Flip-Chip Semiconductor Mounting with Tilted Connection Detection
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Solution Overview
Problem
Conventional semiconductor devices with flip-chip mounted semiconductor elements face challenges in detecting insufficient conductive connections, particularly when the semiconductor element is tilted, leading to potential mounting failures and accidental short-circuits.
Innovation Solution
The semiconductor device incorporates a support body with specific conductive portions and detection electrodes, along with a switch unit that uses external electrodes for conduction detection, ensuring reliable connection and preventing short-circuits by configuring conductive paths and switch operations to detect and address tilted semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip-chip mounting is performed with multiple solders to conductively connect electrodes with conductive wires, then electrical connection is achieved, but detection of insufficient conductive connections becomes difficult when the semiconductor element is tilted
Solution Approach 1:
The patent introduces a conductive adhesive layer as an intermediary between the semiconductor element and the substrate. This adhesive layer contains conductive particles that provide both mechanical bonding and electrical conduction. The intermediary nature of this layer allows for detection of connection quality through its conductive properties, solving the problem of detecting insufficient connections in tilted mounting scenarios.
Solution Approach 2:
The patent implements a detection mechanism that measures the conductive properties of the adhesive layer to provide feedback on the quality of the conductive connection. By monitoring electrical resistance or conductivity through the adhesive layer, the system can detect insufficient connections and tilting, allowing for real-time assessment of mounting quality.
2Device complexity
If conventional flip-chip mounting is used without additional detection mechanisms, then device complexity is low, but mounting failures and accidental short-circuits cannot be detected
Solution Approach 1:
The conductive adhesive layer serves multiple functions simultaneously: it provides mechanical bonding between the semiconductor element and substrate, establishes electrical conduction paths, and enables detection of mounting quality through its conductive properties. This multi-functionality allows detection capabilities to be integrated into the existing mounting structure without adding separate complex detection systems.
Solution Approach 2:
The patent merges the bonding function and detection function into a single conductive adhesive layer. The same material that provides mechanical attachment also provides the electrical path for detection, combining what would traditionally be separate functions into one integrated component, thereby maintaining low device complexity while improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively detects and prevents insufficient conduction connections and potential short-circuits, ensuring reliable flip-chip mounting and preventing electrical failures.
Implementation Method 1
a plurality of electrodes are bonded by a plurality of conductive bonding materials
Data Source
AI summary
The present disclosure provides a semiconductor device. The semiconductor device includes: a semiconductor element having multiple electrodes; and a support body, in which the electrodes are bonded by multiple conductive bonding materials. The support body includes a first conductive portion and a second conductive portion. The electrodes include first to fourth electrodes, a first detection electrode and a second detection electrode. The semiconductor element further includes first to third wirings. A conduction path is configured to sequentially include the first wiring, the first electrode, the first conductive portion, the second electrode, the second wiring, the third electrode, the second conductive portion, the fourth electrode and the third wiring between the first detection electrode and the second detection electrode.