Flip-Chip Via Placement for Shielded RF Package Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flip-chip device packaging methods face challenges in incorporating shielding structures without compromising the encapsulation process, particularly in maintaining RF functionality and signal integrity.
Innovation Solution
The method involves affixing IC devices to a substrate with vias that pass through a mold compound, allowing for shielding without obstructing the encapsulation process, and using a coaxial shield structure to route signals effectively, while applying a mold compound that exposes these vias for improved RF performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shielding structures are added to flip chip devices for signal protection, then signal integrity and RF performance are improved, but the encapsulation process is obstructed and manufacturing complexity increases
Solution Approach 1:
The via structures are formed and positioned on the substrate before the encapsulation process begins. By preparing the shielding structures in advance at the substrate level, the patent enables the encapsulation process to proceed without obstruction, while the pre-positioned vias maintain signal integrity throughout the subsequent manufacturing steps.
2Reliability
If via structures are exposed at the bottom side of mold compound for shielding, then RF performance is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The patent separates the via formation process from the mold compound application process. The vias are created and positioned on the substrate independently, then the mold compound is applied to expose these pre-formed vias at the bottom side. This segmentation allows each process to be optimized independently, reducing the overall manufacturing precision burden while maintaining RF performance.
Data Source
AI summary
A flip chip device includes a substrate, an integrated circuit device, a mold compound, and a via. The substrate has a top side and a bottom side. The integrated circuit device is affixed to the bottom side of the substrate. The mold compound is affixed to the bottom side of the substrate. The via is affixed to the bottom side of the substrate. The via passes through the mold compound and is exposed at a bottom side of the mold compound. The via is coupled to a terminal of the integrated circuit device.