Flip Phone Antenna Ground Extension for Low-Band 5G Performance
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Solution Overview
Problem
The size of the system motherboard in communication terminals, particularly in flip phones, restricts the improvement of low-frequency performance, which is crucial for 5G mobile communication.
Innovation Solution
A communication terminal design featuring an upper flip cover with a metal plate and a lower flip cover connected by a rotating shaft, where the metal plate is connected to the system motherboard, and an automatic tuning circuit controls the connection between the metal plate and the motherboard to enhance low-frequency performance without enlarging the motherboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the system motherboard size is increased to improve low-frequency performance, then antenna excitation effect is improved, but device size is enlarged
Solution Approach 1:
The patent divides the system into two parts: the actual system motherboard and an extended metal plate. The metal plate is electrically connected to the motherboard but physically separate, allowing the antenna excitation area to be extended without increasing the motherboard area. This segmentation resolves the contradiction by separating the functional requirement (large excitation area) from the structural constraint (motherboard size).
Solution Approach 2:
The patent extends the low-frequency antenna excitation area by adding a metal plate in a different spatial dimension rather than enlarging the motherboard in its original plane. The metal plate is positioned adjacent to the motherboard and connected through the rotating shaft area, effectively utilizing three-dimensional space to increase the electrical ground area without increasing the two-dimensional footprint of the device.
2Productivity
If the system motherboard size is increased to maximize antenna excitation, then low-frequency bandwidth is improved, but device compactness is reduced
Solution Approach 1:
The patent segments the electrical ground structure into the motherboard and a separate extendable metal plate. This allows the bandwidth performance to be improved by the extended plate area while the motherboard remains compact, resolving the contradiction between productivity (bandwidth) and ease of operation (compactness).
Solution Approach 2:
The metal plate is designed to be rotatable relative to the motherboard, allowing the structure to adapt between different positions. When rotated into position, it provides extended low-frequency performance; when rotated away, it maintains a compact profile. This dynamic configuration resolves the contradiction by allowing the system to switch between performance mode and compact mode.
3Reliability
If a metal plate is added to extend motherboard effective length, then low-frequency performance is improved, but device complexity is increased
Solution Approach 1:
The metal plate serves multiple functions: it extends the low-frequency antenna ground area, acts as a structural support element, and can rotate to accommodate different device configurations. By making this single component multi-functional, the patent reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved low-frequency performance.
Solution Approach 2:
The metal plate is designed as a thin, flexible component that can be easily manufactured and integrated. Its simple geometric form and thin profile minimize the added complexity while effectively extending the electrical ground area. The flexibility allows it to be positioned and connected without requiring complex mounting mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design extends the effective length of the system motherboard, optimizing low-frequency performance by maximizing antenna excitation and reducing power consumption, particularly for 600-900 MHz frequencies.
Implementation Method 1
The metal elastic sheet is disposed in the rotating shaft and penetrates the rotating shaft. Two ends of the metal elastic sheet are respectively connected to the system motherboard and the metal plate
Data Source
AI summary
A communication terminal includes an upper flip cover and a lower flip cover rotatably connected to each other. The upper flip cover is provided with a metal plate. The lower flip cover is provided with a system motherboard. The system motherboard is connected to the metal plate.