Flipped Active Component Transfer via Dual-Stamp Adhesion
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Solution Overview
Problem
Current methods for distributing electronically active components on substrates are limited by material waste, high processing costs, and equipment expenses, particularly when using inorganic semiconductor materials, and face challenges in transferring active components with variable topography and size constraints.
Innovation Solution
A method involving a source substrate with active components, a first stamp with smaller pillars for initial adhesion, and a second stamp with larger pillars or vacuum collets for enhanced adhesion, allowing for the transfer of active components to a destination substrate with improved adhesive strength and reduced material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic semiconductor materials are used to form active components on substrates, then electronic performance is improved, but material cost and processing cost increase
Solution Approach 1:
The substrate is divided into multiple regions with different materials: a first substrate region with inorganic semiconductor material for high-performance active components, and a second substrate region with organic semiconductor material for lower-performance components. This segmentation allows each region to be optimized for its specific function, reducing overall processing costs while maintaining high performance where needed.
Solution Approach 2:
Different regions of the substrate are assigned different material qualities: the first substrate region uses inorganic semiconductor material with superior electronic characteristics for critical components, while the second substrate region uses organic semiconductor material for less demanding applications. This local quality differentiation optimizes the balance between performance and cost.
2Reliability
If inorganic semiconductor materials are processed to improve electronic characteristics, then electron mobility is improved, but processing complexity and equipment cost increase
Solution Approach 1:
The processing system is segmented into two parallel pathways: one for inorganic semiconductor material requiring complex processing steps to achieve high electron mobility, and another for organic semiconductor material with simpler processing requirements. This segmentation distributes processing complexity across different material systems rather than concentrating it all on inorganic materials.
3Loss of substance
If active components are formed on separate substrates and placed on a substrate, then material utilization is improved, but assembly complexity and equipment cost increase
Solution Approach 1:
The invention merges the formation of active components directly onto the final substrate in two distinct regions, eliminating the need for separate component fabrication on different substrates followed by assembly. The inorganic semiconductor active components are formed directly on the first substrate region, and organic semiconductor active components are formed directly on the second substrate region, integrating component fabrication and substrate preparation into a single unified process.
4Adaptability or versatility
If plastic substrates are used, then manufacturing flexibility is improved, but chemical and heat tolerance decrease
Solution Approach 1:
The substrate system is segmented into two functional regions: the first substrate region with inorganic semiconductor material that provides chemical and heat tolerance for robust processing, and the second substrate region with organic semiconductor material that enables manufacturing flexibility. This segmentation allows the system to simultaneously achieve both tolerance and flexibility by assigning different functional requirements to different regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-performance active component transfer with variable topography, reducing material and processing costs by utilizing flexible substrates and minimizing additional electrical connection steps, thus enhancing manufacturing efficiency and throughput.
Implementation Method 1
A first stamp having first pillars protruding therefrom is pressed against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars
Implementation Method 2
A second stamp having second pillars protruding therefrom is pressed against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars. The respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars
Implementation Method 3
The second stamp including the active components on the second pillars thereof is pressed against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate
Data Source
AI summary
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts.