Flipped Semiconductor Cell Architecture with Backside Power Routing
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Solution Overview
Problem
In semiconductor device design, connecting identical semiconductor cells for signal routing increases the length of the signal routing path, leading to higher contact resistance and device complexity.
Innovation Solution
A semiconductor device cell architecture is developed using a backside power distribution network (BSPDN), where each semiconductor cell implements the same logic circuit and is connected such that an output pin of one cell is connected to an input pin of another cell, with the second cell being a flipped version of the first, eliminating the need for additional interconnect structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If additional interconnect structures such as metal lines and vias are used to connect semiconductor cells, then signal routing is enabled, but the signal routing path length increases and contact resistance increases
Solution Approach 1:
The patent utilizes the backside of the semiconductor substrate as an additional dimension for power distribution. By forming backside power rails on the opposite side of the front surface, the design enables power delivery without requiring additional front-side interconnect structures, thereby reducing signal routing path length and contact resistance while maintaining ease of operation.
Solution Approach 2:
The patent inverts the conventional power distribution approach by placing power rails on the backside of the substrate rather than the front surface. This inversion allows power delivery to occur through the substrate thickness dimension, eliminating the need for extensive front-side metal lines and vias, thus reducing both path length and contact resistance.
2Ease of operation
If additional interconnect structures such as metal lines and vias are used to connect semiconductor cells, then signal routing is enabled, but device complexity increases
Solution Approach 1:
The patent moves the power distribution function to the backside dimension of the substrate, eliminating the need for complex front-side interconnect structures. This dimensional relocation simplifies the overall device architecture by reducing the number of metal lines and vias required for power delivery.
Solution Approach 2:
The backside power rails serve multiple functions: they provide power distribution across the substrate, act as a common power source for multiple semiconductor cells, and eliminate the need for individual power routing to each cell. This multi-functionality reduces device complexity while maintaining ease of operation.
3Ease of manufacture
If semiconductor cells are connected with standard orientation, then manufacturing is simplified, but signal routing path length increases
Solution Approach 1:
The patent inverts the orientation of alternating semiconductor cells (e.g., 1st cell upright, 2nd cell upside down, 3rd cell upright, etc.). This inversion, combined with backside power rails, enables direct alignment of input and output pins between adjacent cells, significantly reducing signal routing path length while maintaining manufacturing simplicity through standardized cell fabrication.
Data Source
AI summary
Provided is a semiconductor device based on a cell architecture which includes: a 1st semiconductor cell; and a 2nd semiconductor cell which is connected to the 1st semiconductor cell in a 1st direction such that an output pin of the 1st semiconductor cell is connected to an input pin of the 2nd semiconductor cell, wherein the 2nd semiconductor cell is in a form in which the 1st semiconductor cell is turned upside down.