Flipped Hall Current Sensor Layout for Closer Conductor Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional current sensors based on Hall effect elements are susceptible to environmental damage, generate excessive heat, and require robust packaging that increases the distance between the active surface of the substrate and the conductor, reducing sensitivity to magnetic fields.
Innovation Solution
A current sensor system with a flipped integrated circuit configuration where the active surface faces away from the conductor, utilizing a substrate supported by inner lead portions that act as a conductive shield, allowing for a coreless design with reduced distance to the conductor and enhanced sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the active surface of the substrate faces the conductor to minimize distance, then sensitivity to magnetic fields is improved, but the integrated circuit is more susceptible to environmental damage and heat generation
Solution Approach 1:
The patent inverts the conventional orientation by flipping the integrated circuit substrate 180 degrees so that the active surface faces away from the conductor rather than toward it. This inversion allows the active surface to be positioned closer to the conductor for improved sensitivity while the back surface remains exposed to the environment for better heat dissipation and environmental protection.
Solution Approach 2:
The patent segments the substrate into functionally distinct surfaces: the front surface (with active circuitry) optimized for magnetic field sensing, and the back surface (with passive components) optimized for heat dissipation and environmental protection. This segmentation allows each surface to be optimized for its specific function without compromise.
2Reliability
If robust packaging housing is used to protect the integrated circuit from environmental elements, then reliability is improved, but the distance between the active surface and conductor increases reducing sensitivity
Solution Approach 1:
The patent inverts the substrate orientation so that the active surface can be positioned close to the conductor for high sensitivity while the back surface with passive components faces the environment. This eliminates the need for bulky protective housing that would increase distance and reduce sensitivity.
Solution Approach 2:
The patent applies different quality requirements to different parts of the substrate: the front surface with active circuitry is optimized for sensitivity and positioned close to the conductor, while the back surface with passive components is designed for environmental protection and heat dissipation. This local differentiation allows robust protection without compromising sensitivity.
3Measurement precision
If the active surface is positioned close to the conductor for high sensitivity, then measurement precision is improved, but heat generation in the small volume increases
Solution Approach 1:
The patent inverts the substrate orientation so that the active surface can be positioned close to the conductor for high sensitivity while the back surface with passive components faces away, providing better heat dissipation pathways and reducing temperature buildup in the compact volume.
Solution Approach 2:
The patent segments thermal management functions by positioning heat-generating active components on the front surface close to the conductor for sensitivity, while heat-dissipating passive components are positioned on the back surface with better thermal access to the environment, enabling effective heat management in the compact package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system improves sensitivity to magnetic fields by minimizing the distance to the conductor, reduces heat generation, and provides effective shielding against environmental factors, enhancing the reliability and performance of current sensing.
Implementation Method 1
the inner lead portions form a conductive shield between the substrate and the conductor
Implementation Method 2
Conventional current sensors based on Hall effect elements are well known in the art. The Hall effect is the production of a voltage difference (the Hall voltage) across an electrically conductive material
Data Source
Figure 1~4
Figure 5~7
Figure 8a~10
AI summary
The present invention relates to a current sensor system comprising a conductor and a packaged integrated circuit for sensing a current in the conductor, said conductor being external to the packaged integrated circuit. The packaged integrated circuit comprises : - a substrate (2) having an active surface (3) and a back surface (4), - one or more magnetic sensing elements (7) disposed in or on the active surface of the substrate, - a processing circuit disposed in or on the active surface of the substrate and arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor, - a housing (1), - a plurality of leads (8) having an outer lead portion extending outside the housing and an inner lead portion, - electrical connections (6) between the leads and the active surface of the substrate, wherein the back surface of the substrate is disposed on a support (5) formed by at least two inner lead portions of said plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.