Floating Auxiliary PCA Module for Repairable Cooling Alignment
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Solution Overview
Problem
The integration of primary and auxiliary electronic components on the same circuit board leads to challenges such as difficult repairs due to collateral damage risks, space constraints, and inefficient cooling, especially when auxiliary components are provided as a separate module, resulting in poor thermal performance and increased manufacturing costs.
Innovation Solution
A separate auxiliary module with a cooling component and PCA that allows for relative movement and alignment with the processor PCA, using floating electrical connections and mechanical attachments to ensure proper thermal contact and alignment with the cooling conduit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If auxiliary electronic components are integrated on the same circuit board as primary components, then space utilization is improved, but repair difficulty increases due to collateral damage risks
Solution Approach 1:
The patent divides the electronic components into separate modules: a primary PCA containing primary electronic components and an auxiliary PCA containing auxiliary electronic components. This segmentation allows the auxiliary components to be replaced independently without risking damage to the primary components, thus improving ease of repair while maintaining space utilization through compact modular design.
2Ease of repair
If auxiliary electronic components are provided as a separate module, then ease of replacement is improved, but thermal performance deteriorates due to poor thermal contact
Solution Approach 1:
The patent employs a floating connection mechanism that allows the auxiliary PCA to move dynamically to achieve optimal thermal contact with the cooling component. The electrical connector is designed to accommodate relative movement between the auxiliary PCA and primary PCA, enabling the cooling component to self-align and maintain consistent thermal contact pressure, thus improving thermal performance while preserving ease of replacement.
3Temperature
If cooling component is rigidly fixed to ensure thermal contact, then thermal performance is improved, but alignment precision with cooling conduit deteriorates due to tolerance accumulation
Solution Approach 1:
The patent replaces rigid fixed connections with a floating connection system that allows dynamic adjustment. The auxiliary PCA can move relative to the primary PCA within defined tolerances, enabling the cooling component to self-align with the cooling conduit during assembly. This dynamic alignment mechanism compensates for manufacturing tolerances and prevents tolerance accumulation, achieving both high thermal performance and alignment precision.
Solution Approach 2:
The cooling component is designed to automatically self-align with the cooling conduit through the floating connection mechanism. The relative movement capability allows the system to self-correct alignment deviations without requiring precise pre-positioning or complex alignment procedures, thus improving manufacturing precision while maintaining effective thermal contact.
4Device complexity
If auxiliary components are integrated on the same board, then device complexity is reduced, but manufacturing cost increases due to space constraints and cooling inefficiency
Solution Approach 1:
The patent segments the electronic components into separate PCAs that can be manufactured independently using standardized processes. This modular approach reduces manufacturing complexity by allowing each module to be produced separately with optimized layouts, avoiding the space constraints and cooling design challenges of integrated boards. The standardized interfaces between modules further reduce assembly costs and improve manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy replacement of auxiliary components without damaging the primary PCA, reduces service costs, prevents accidental damage, and achieves high thermal performance by allowing self-alignment with the cooling conduit.
Implementation Method 1
a cooling component (122) of the auxiliary module (102) is positioned on an auxiliary PCA (118) of the auxiliary module (102) and a cooling conduit (110) such that a first portion (122A) of the cooling component (122) is disposed on the cooling conduit (110)
Data Source
AI summary
Auxiliary module includes attachment elements, cooling component, and auxiliary PCA having a circuit board, an electrical connector, and electronic components. The attachment elements are configured to attach the auxiliary module to supporting arms protruding from the PCA such that the electrical connector is coupled to a complementary electrical connector of the PCA, and the attachment elements extend through apertures in the supporting arms. The cooling component is attached to the auxiliary PCA and includes a first portion thermally coupled to cooling conduit in an installed state of the auxiliary module and a second portion thermally coupled to the electronic components in an attached state of the cooling component to the auxiliary PCA. In an attached state of the auxiliary module to the supporting arms and a coupled state of the electrical connector with the complementary electrical connector, the auxiliary module is movable along multiple directions relative to the supporting arms.