Floating Backplane Interconnects for Thermal Misalignment Tolerance
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Solution Overview
Problem
In data center blade computer systems, the coefficient of thermal expansion differences between backplane connectors and printed circuit boards can cause misalignment and disrupt electrical connections, especially in high-density interconnects with low tolerance for displacement, potentially leading to connection failure in varying temperature environments.
Innovation Solution
The implementation of floating backplane interconnects with flex circuits and registration features that allow for flexible movement while maintaining electrical contact, reducing the susceptibility to connection breakage due to thermal expansion and compression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid backplane connectors are used to ensure stable electrical connection, then connection reliability is improved, but thermal expansion mismatch causes misalignment and connection failure
Solution Approach 1:
The patent applies the dynamics principle by transforming the rigid backplane connector into a floating connector that can dynamically adjust its position. The floating connector is suspended by a flexible support structure that allows it to move vertically and horizontally, enabling it to adapt to thermal expansion and contraction of the backplane while maintaining reliable electrical connection with the blade connector.
Solution Approach 2:
The patent applies parameter changes by modifying the physical state and position parameters of the backplane connector. The floating connector's position is no longer fixed but can change in response to thermal parameters. The flexible support structure changes the connector's vertical position and orientation based on backplane deformation, allowing the connection to maintain electrical contact despite dimensional changes.
2Productivity
If high-density interconnects are implemented to increase connection capacity, then productivity is improved, but tolerance for displacement is reduced making connections more susceptible to misalignment
Solution Approach 1:
The floating connector design provides dynamic adjustment capability that compensates for the reduced alignment tolerance in high-density interconnects. By allowing the connector to move and self-align, the system can maintain precise electrical contact even with minimal tolerance, enabling high-density packaging without sacrificing connection reliability.
3Adaptability or versatility
If floating backplane interconnects are used to accommodate thermal expansion, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent introduces a flexible support structure as an intermediary element between the backplane and the floating connector. This intermediary component absorbs the complexity of thermal adaptation, providing a simple yet effective mechanism that allows the rigid connector to float and adjust its position without requiring complex active control systems or multiple adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The floating backplane interconnects ensure displacement-tolerant electrical connections, maintaining integrity and reducing the risk of failure even in environments with significant temperature variations, such as supercomputing settings.
Implementation Method 1
the coefficient of thermal expansion (CTE) of the backplane 116 may be different than the CTE of a PCB 106(2) of the blade computer 104 that supports the edge backplane connector(s) 112 of a respective blade computer 104. This can cause relative vertical displacement strain between the backplane connector(s) 112 of a blade computer 104 and the complementary backplane connector(s) 114 on the backplane 116.
Implementation Method 2
The floating backplane interconnects are configured to flexibly move and be displaced relative to the backplane while still retaining an electrical connection to the backplane.
Data Source
AI summary
Backplane employing floating backplane network interconnects for electrical coupling with blade computer systems and related methods. To provide a displacement tolerant interconnection system between the backplane interconnects and respective blade backplane interconnects of blade computer systems to establish electrical connections therebetween, the backplane interconnects are provided as floating backplane interconnections. The floating backplane interconnects are configured to move and be displaced relative to the backplane while still retaining an electrical connection to the backplane. The backplane interconnects each include one or more flex circuits connected to electrical interconnects on the backplane on a first end, and electrical interconnects on a backplane connector on a second end. The flex circuit(s) include an electrical cable that includes a polymer or other material surrounding electrical wires to allow the flex circuit and its internal electrical wires to bend and flex, and thus move relative to backplane.