Floating Board-Level Architecture for Impact-Resistant Cooling
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Solution Overview
Problem
The relative movement between a heat sink and a circuit board due to external impact or force affects thermal coupling, leading to diminished cooling efficiency and potential damage to heat generation components in electronic devices.
Innovation Solution
A board-level architecture that includes a support plate, heat sink, circuit board, connection members, and buffers to allow the circuit board to float relative to the heat sink, using elastic members to maintain thermal coupling and absorb impact, reducing the risk of damage to thermal interface materials and heat generation components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the heat sink is disposed to float relative to the circuit board, then the heat sink can accommodate thermal expansion and installation misalignment, but the heat sink may be skewed due to external force, affecting thermal coupling
Solution Approach 1:
The heat sink is designed to move dynamically relative to the circuit board along a predetermined movement trajectory through a guide structure. This dynamic capability allows the heat sink to accommodate thermal expansion and installation misalignment while the guide structure prevents skewing due to external forces, thus maintaining reliable thermal coupling.
Solution Approach 2:
A guide structure acts as an intermediary between the heat sink and the circuit board, allowing controlled movement while preventing unwanted skewing. This intermediary mechanism enables the heat sink to adapt to thermal expansion and misalignment without compromising thermal coupling stability.
2Temperature
If the heat sink has substantial mass for effective heat dissipation, then cooling performance is improved, but impact force during falls is increased, potentially damaging components
Solution Approach 1:
A buffer structure is provided between the heat sink and the circuit board that absorbs impact energy during falls or external shocks. This beforehand cushioning protects the circuit board and other components from damage caused by the substantial mass of the heat sink during impact events.
Solution Approach 2:
The buffer structure serves as an intermediary that decouples the heat sink's substantial mass from the circuit board during impact events. It absorbs shock energy while allowing the heat sink to maintain its position for effective heat dissipation during normal operation.
3Stability of the object's composition
If the circuit board is rigidly fixed to the support plate, then structural stability is improved, but relative movement during impact cannot be absorbed, increasing damage risk
Solution Approach 1:
The circuit board is connected to the support plate through a connection structure that allows controlled relative movement during impact events. This dynamic connection absorbs impact energy while maintaining structural stability during normal operation, preventing damage to components.
Solution Approach 2:
The connection structure between the circuit board and support plate incorporates cushioning elements that absorb impact energy before it reaches vulnerable components. This beforehand cushioning maintains structural stability while protecting against impact damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The architecture effectively reduces the impact on circuit boards, maintains thermal coupling, and prevents damage to heat generation components by allowing the circuit board to move relative to the heat sink, thereby enhancing cooling efficiency and reducing the risk of component damage during external impacts.
Implementation Method 1
The first buffer is configured to provide acting force for driving the first circuit board to move toward the first heat sink
Implementation Method 2
The first heat generation component is thermally coupled to the first heat sink
Data Source
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AI summary
The present disclosure discloses a board-level architecture and an electronic device, and pertains to the field of electronic device technologies. The board-level architecture includes a support plate, a first heat sink, a first circuit board, a first connection member, and a first buffer. The first heat sink and the support plate are disposed opposite to each other and are fastened to each other. The first circuit board is located between the first heat sink and the support plate. The first circuit board is connected to the first heat sink through the first connection member and can move toward or away from the first heat sink. A first heat generation component is on a side that is of the first circuit board and that is close to the first heat sink. The first heat generation component is thermally coupled to the first heat sink. The first buffer is configured to provide acting force for driving the first circuit board to move toward the first heat sink. The first circuit board can float relative to the first heat sink. In this way, when the electronic device falls or is subjected to external impact, relative movement can occur between the first circuit board and the first heat sink, to reduce impact on the first circuit board.