Floating Circuit Board Connector Layout for GPU PMM Cooling

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Solution Overview

Problem

Existing PMM components face challenges in providing GPU functionality due to space constraints and inefficient cooling, especially with their thermally-serial positioning, which reduces cooling efficiency.

Innovation Solution

The introduction of 'double-wide' PMM components with increased width and thermally-parallel subsystem positioning, along with a mounted circuit board and a floating circuit board connection system that allows for relative movement, addresses these issues by providing additional space and improving cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the width dimension of PMM components is increased to double-wide dimensions to provide sufficient space for GPU functionality and supporting subsystems, then the available board space increases, but pin alignment difficulty increases significantly

Engineering Contradiction:
Improveboard spaceVSAvoidpin alignment
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The circuit board is divided into a mounted circuit board portion and a floating circuit board portion. The mounted portion contains first component connectors that are fixedly mounted to the computing device, while the floating portion contains second component connectors that can move relative to the computing device. This segmentation allows the board to provide both the increased space needed for GPU functionality and the alignment tolerance needed for manufacturing, as the floating portion can adjust to accommodate pin alignment variations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The floating circuit board portion is designed to be moveable relative to the computing device, transitioning from a static to a dynamic configuration. This moveability allows the second component connectors to self-align with the first component connectors during insertion, accommodating manufacturing tolerances and thermal expansion without requiring extremely tight pin alignment precision in the double-wide format.

Inventive Principle:
Principle #15Dynamics

2Ease of manufacture

If subsystems are positioned in a thermally-serial arrangement on the circuit board, then manufacturing is simplified, but cooling efficiency decreases due to heated air being reused

Engineering Contradiction:
Improvesubsystem positioningVSAvoidcooling efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The floating circuit board portion extends in a direction substantially perpendicular to the direction of extension of the mounted circuit board portion, creating a multi-dimensional layout. This allows subsystems to be positioned in a thermally-parallel arrangement where cooling air can flow across multiple subsystems simultaneously without being re-heated, improving cooling efficiency while maintaining manufacturing feasibility through the modular floating board design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12615732B2Mounted circuit board/floating circuit board component connection system
Publication Date: 2026.04.28 DELL PROD LP
  • US12615732B2 patent drawing
  • US12615732B2 patent drawing
  • US12615732B2 patent drawing

AI summary

A mounted circuit board/floating circuit board component connection system includes a computing device chassis. A mounted circuit board includes a plurality of first component connectors that are configured to connect to a component, and is mounted to the computing device chassis such that relative movement of the mounted circuit board and the computing device chassis is resisted. A floating circuit board includes a plurality of second component connectors that are configured to connect to the component, and is moveably coupled to the computing device chassis such that the floating circuit board is configured to move relative to the computing device chassis when the component connects to the plurality of first component connectors included on the mounted circuit board.