Floating-Chip Pressure Sensor Anchoring Tethers
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Solution Overview
Problem
Conventional pressure sensor chip mounting techniques using adhesives or glass frit bonding introduce measurement errors due to stress-related issues from thermal expansion and external pressures, affecting accuracy and reliability.
Innovation Solution
A pressure sensor device with a header featuring tether connecting regions and anchoring tethers that allow the sensor chip to move freely within the header, limiting its movement through flexible wire interconnections and mechanical stops, eliminating direct mechanical attachment and reducing stress transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive or glass frit bonding is used to secure the sensor chip to the header, then the chip can be firmly mounted and standardized packaging techniques can be used, but stress is transferred to the chip from thermal expansion and external pressure causing measurement errors
Solution Approach 1:
The patent introduces a compliant mounting layer as an intermediary between the sensor chip and the header. This layer acts as a stress-isolating mediator that decouples the chip from mechanical stresses caused by thermal expansion and external pressure, while still providing firm mounting and electrical connectivity through conductive pathways.
Solution Approach 2:
The patent changes the mechanical parameter of the mounting structure by using a compliant material with appropriate elastic modulus and thickness. This parameter change allows the mounting layer to deform elastically under stress, absorbing stress variations before they reach the chip, thereby maintaining measurement precision while ensuring reliable mounting.
2Strength
If a hard epoxy adhesive is used to secure the chip, then strong bonding strength is achieved, but high stress is transferred to the chip from thermal expansion and external pressure
Solution Approach 1:
The patent changes the mechanical parameter of the adhesive from hard epoxy to a compliant material with lower elastic modulus. This parameter change reduces the stiffness of the bonding layer, allowing it to deform elastically under stress and thereby reduce stress transmission to the chip while maintaining adequate bonding strength through proper material selection and layer thickness control.
3Stability of the object's composition
If the chip is rigidly mounted to the header, then stable positioning is achieved, but measurement errors occur due to stress from dimensional changes in the housing
Solution Approach 1:
The patent transitions from a static rigid mounting to a dynamic compliant mounting system. The compliant layer can elastically deform in response to dimensional changes in the housing, allowing the chip to maintain stable positioning while accommodating thermal expansion and external pressure variations without transferring stress that would cause measurement errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy and stability of pressure measurements by minimizing stress-related errors, making the sensor system suitable for high-vibration and high-temperature environments while maintaining precision.
Implementation Method 1
One or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header
Data Source
AI summary
Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.