Floating Conductive Pattern for Semiconductor Light Emitting Device
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Solution Overview
Problem
Semiconductor light emitting devices face challenges in enhancing light emission efficiency and preventing defects such as cracking, particularly at the corners of the conductive patterns, which can lead to electrical shorts and reduced device reliability.
Innovation Solution
The introduction of a floating conductive pattern, which is electrically isolated and spaced apart from the primary conductive patterns, is used to cover the corners and edges of the semiconductor light emitting device. This pattern is formed of the same material as the conductive patterns and is designed to be conformal, preventing defects by reducing stress and potential cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conductive patterns are placed close to each other to reduce device area, then device integration is improved, but electrical shorts due to metal diffusion or cracking increase
Solution Approach 1:
An insulating pattern is introduced as an intermediary barrier between adjacent conductive patterns. This insulating pattern prevents direct contact between conductive patterns, blocking metal diffusion and electrical shorts while allowing the conductive patterns to be placed closer together for better device integration.
Solution Approach 2:
The device structure is segmented into distinct functional regions: conductive patterns for electrical connection, insulating patterns for electrical isolation, and floating conductive patterns for stress relief. This segmentation allows each component to perform its specific function without interfering with others, enabling closer spacing of conductive patterns while maintaining reliability.
2Reliability
If conductive patterns are made thicker to improve electrical connection, then electrical conductivity is improved, but stress and cracking increase
Solution Approach 1:
The electrical connection function is segmented between two components: the conductive pattern provides the primary electrical pathway, while the floating conductive pattern provides stress relief. This segmentation allows the main conductive pattern to be thinner for reduced stress, while still achieving good electrical connection through the combined effect of both conductive patterns.
Solution Approach 2:
The thickness parameter of the conductive pattern is optimized to balance electrical conductivity and stress resistance. By changing the thickness parameter to an optimal value and adding the floating conductive pattern, the device achieves sufficient electrical connection without the excessive stress and cracking that would result from thicker conductive patterns.
3Ease of manufacture
If device structure is simplified to reduce manufacturing complexity, then manufacturing ease is improved, but defect prevention capability decreases
Solution Approach 1:
The insulating pattern and floating conductive pattern are formed in advance during the manufacturing process, before final device assembly. This preliminary action prevents defects such as metal diffusion and cracking from occurring during subsequent processing steps, while the overall manufacturing complexity remains manageable through standardized fabrication techniques.
Data Source
AI summary
A semiconductor light emitting device including a floating conductive pattern is provided. The semiconductor light emitting device includes a first semiconductor layer including a recessed region and a protruding region, an active layer and a second semiconductor layer disposed on the protruding region, a contact structure disposed on the second semiconductor layer, a lower insulating pattern covering the first semiconductor layer and the contact structure, and having first and second openings, a first conductive pattern disposed on the lower insulating pattern and extending into the first opening, a second conductive pattern disposed on the lower insulating pattern and extending into the second opening, and a floating conductive pattern disposed on the lower insulating pattern. The first and second conductive patterns and the floating conductive pattern have the same thickness on the same plane.