Floating Connector Sleeve Grounding With Mesh Ventilation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing electronic device connectors suffer from signal noise due to improper grounding, leading to reduced data rates and electromagnetic interference, and lack adequate ventilation and aesthetically pleasing designs.

Innovation Solution

The solution involves properly grounded connector receptacles with conductive sleeves and shielding connected to a board ground plane, along with ventilated enclosures featuring mesh-like designs and tapered sleeves to enhance airflow and concealment of conductive structures, while maintaining compliance with various interconnect standards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional connector receptacles are used without proper grounding structures, then the device enclosure can be simpler in structure, but signal noise increases and data transmission reliability deteriorates

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidconnector receptacle structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the grounding structure with the connector receptacle by integrating a conductive sleeve that extends from the enclosure wall into the receptacle. This merging of grounding and connector functions into a single integrated structure provides proper grounding without significantly increasing overall device complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive sleeve acts as an intermediary element between the enclosure wall and the connector receptacle, providing a dedicated ground path. This intermediary structure mediates between the external connector and the internal circuit board, ensuring proper grounding while maintaining structural organization

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the device enclosure uses solid walls for aesthetic appearance, then the appearance quality improves, but ventilation capability and heat dissipation performance worsen

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidenclosure appearance
Core Design Contradiction:
TemperatureVSShape

Solution Approach 1:

The patent applies local quality by using a mesh pattern specifically in regions requiring ventilation while maintaining solid wall construction in areas prioritizing aesthetic appearance. This localized application of different structural qualities allows simultaneous optimization of both heat dissipation and appearance

Inventive Principle:
Principle #3Local quality

3Reliability

If thicker sleeves are used for connector receptacles to ensure proper grounding and shielding, then grounding reliability improves, but ventilation capability and aesthetic appearance deteriorate

Engineering Contradiction:
Improvegrounding reliabilityVSAvoidventilation capability
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The sleeve structure is segmented into distinct functional zones: a thicker portion providing grounding and shielding functions, and a thinner portion allowing ventilation. This segmentation allows each section to be optimized for its specific function without compromising overall performance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent addresses the contradiction by transitioning from a uniform thickness design to a variable thickness design along the longitudinal axis of the sleeve. This dimensional variation allows the sleeve to provide adequate grounding where needed while maintaining ventilation capability in other regions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides effective grounding, improved ventilation, and an aesthetically pleasing appearance, reducing signal noise and heat dissipation issues while maintaining compatibility with diverse electronic devices.

Implementation Method 1

The shielding can further be electrically connected to traces or pads of a board or other appropriate substrate on which the connector receptacles are mounted. This ground path from the enclosure wall, through the sleeve, conductive structure, connector receptacle shielding, and board ground plane provides a proper ground path

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

These circuits can consume large amounts of power and dissipate a great deal of heat. This heat can compromise device performance. It can therefore be desirable that the device enclosure allow this heat to escape. In unclaimed examples, the enclosure wall can be formed to have the appearance of being a mesh

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP3629429B1Io integration with floating connectors in a mesh
Publication Date: 2024.11.06 APPLE INC
  • EP3629429B1 patent drawingFigure 1
  • EP3629429B1 patent drawingFigure 2
  • EP3629429B1 patent drawingFigure 3

AI summary

Connector receptacles and device enclosures that can provide proper grounding, improved ventilation, and an aesthetically pleasing appearance. An example can include a device enclosure including an enclosure wall and sleeves for a number of connector receptacles. Each sleeve can electrically contact a shield of a corresponding connector receptacle via a conductive structure, such as a conductive gasket, to provide a good ground path. The sleeves can be narrow at the enclosure wall for improved ventilation and an aesthetically pleasing appearance.