Floating Connector Assembly That Bypasses Solder Joint Compression
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Solution Overview
Problem
High performance co-packaged electronic systems experience reliability issues due to compressive force on solder connections between electronic components, which degrade at elevated operating temperatures, leading to mechanical and electrical integrity problems.
Innovation Solution
A stack assembly design that includes a first component above the electronic component and a second component below, held together by fasteners, where the force path does not pass through the circuit board interface, reducing compressive force on solder connections and using voids or channels in the circuit board to avoid direct force transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fasteners are used to press plugs against the electronic component, then reliable plug connections are achieved, but additional compressive force is applied to the solder connections between the electronic component and circuit board
Solution Approach 1:
The patent divides the force transmission path into separate segments: the fastener force path (through first and second components) is segmented from the solder connection interface. This allows the plug pressing force to be applied independently without transmitting compressive force through the solder connections, resolving the contradiction between reliable plug connection and reduced solder stress
Solution Approach 2:
The first component (attached to electronic component) and second component (attached to circuit board) act as intermediary elements that mediate the force transmission. These intermediaries create an alternative force path that bypasses the solder connections, enabling plug pressing force application without directly compressing the solder joints
2Strength
If compressive force is applied to ensure mechanical integrity, then plug connections are secured, but solder connections degrade at elevated operating temperatures
Solution Approach 1:
The mechanical strength function is segmented from the solder connections by introducing separate first and second components that bear the compressive load. This segmentation protects the solder joints from thermal degradation while maintaining overall mechanical integrity through the alternative force path
Solution Approach 2:
The first and second components serve as protective intermediaries between the fastener and the solder connections. They absorb and transmit the compressive force away from the temperature-sensitive solder joints, preserving solder reliability under thermal stress while maintaining mechanical strength
3Strength
If force is transmitted through the circuit board interface, then structural support is provided, but shear stress and rotation occur at the solder connections
Solution Approach 1:
The force transmission is segmented into two independent paths: one through the first and second components for plug pressing force, and another through the circuit board interface for structural support. This segmentation prevents shear stress and rotation at the solder connections by isolating the plug pressing force from the interface
Solution Approach 2:
The first component acts as an intermediary that attaches to the electronic component without transmitting shear forces to the solder connections. This intermediary enables structural support through the circuit board interface while preventing harmful shear stress and rotation at the vulnerable solder joints
Data Source
AI summary
An assembly operable with a large number of high speed signals and including a plug connector pressure mounted to an electronic component that is also attached to a circuit board via an array of solder connections. A stack may be formed with the electronic component, a first component above, and a second component below the electronic component. All or a portion of the second component may fit between the electronic component and the circuit board. A force pressure mounting the plug to the electronic component may be generated by a fastener extending between the first component and the second component such that the force is transmitted along a force path that does not include the interface between the circuit board and electronic component. The assembly may include one or more structures to resist twisting the electronic component relative to the circuit board.