Floating Contacts for EMI Shielding in Semiconductor Interconnects
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Solution Overview
Problem
The challenge in semiconductor device design is to achieve improved quality, yield, performance, and reliability while reducing complexity and volume, particularly in scaling down semiconductor devices for increased computing ability, while also addressing the issue of electro-magnetic interference.
Innovation Solution
The semiconductor device incorporates a first and second semiconductor structure connected through a first connecting structure with a plurality of connecting and supporting contacts, forming signal-transmitting and electrically floating contacts, respectively, which enhance bonding strength and implement electro-magnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the dimensions of semiconductor devices are scaled down to meet increasing computing ability demand, then computing ability is improved, but electro-magnetic interference issues increase in quantity and complexity
Solution Approach 1:
Electrically floating contacts are introduced as intermediary elements between signal-transmitting contacts. These floating contacts act as shielders that do not directly transmit signals but provide electro-magnetic interference protection, thereby resolving the interference issue while maintaining the scaled-down device architecture and computing ability improvements
2Object-affected harmful factors
If more electro-magnetic interference shielding is implemented between signal-transmitting contacts, then interference protection is improved, but device complexity increases
Solution Approach 1:
The electrically floating contacts are merged with the existing connecting structure, forming an integrated solution where shielding functionality is combined with the interconnection architecture. This approach provides electro-magnetic interference protection without requiring separate, additional shielding structures, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for more sophisticated functionality in a reduced volume, lowering costs and increasing profit, while improving bonding strength and effectively shielding against electro-magnetic interference.
Implementation Method 1
forming electrically floating contacts between the signal-transmitting contacts
Data Source
AI summary
The present disclosure provides a semiconductor device including a first semiconductor structure, a first connecting structure positioned on the first semiconductor structure, a second connecting structure positioned on the first connecting structure, and a second semiconductor structure positioned on the second connecting structure. The first connecting structure includes a plurality of first connecting contacts and a plurality of first supporting contacts positioned in a first connecting insulating layer. The second connecting structure includes a plurality of second connecting contacts and a plurality of second supporting contacts positioned in the second connecting insulating layer positioned on the first connecting structure. The plurality of first connecting contacts contact the plurality of second connecting contacts, forming signal-transmitting contacts. The plurality of first supporting contacts contact the plurality of second supporting contacts, forming electrically floating contacts for implementing electro-magnetic interference shielding between the signal-transmitting contacts.