Floating Coupler Pads for Leakage Current Reduction
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Solution Overview
Problem
High voltage components in microelectronic devices face challenges in reducing leakage current through coupler components, which affects the functionality and reliability of these devices.
Innovation Solution
A microelectronic device design featuring a first die attached to a conductive die pad and a second die attached to another conductive die pad, with a coupler component connected to a magnetically permeable member that is isolated from both dies and external leads, using transformer windings to transfer signals and reducing direct current flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If direct electrical coupling is used between high voltage and low voltage components, then signal transfer is simple, but leakage current increases
Solution Approach 1:
The patent introduces a coupler component with magnetically permeable members as an intermediary between high voltage and low voltage components. This mediator transfers signals through magnetic coupling rather than direct electrical contact, eliminating leakage current while maintaining signal transfer functionality. The coupler pad structure with floating pads further reinforces this isolation mechanism.
2Reliability
If coupler components are used to reduce leakage current, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent combines the coupler component and magnetically permeable members into an integrated assembly that is attached to the substrate alongside the high voltage and low voltage components. This merging approach simplifies manufacturing by reducing the number of separate assembly steps and ensuring proper alignment through the integrated structure, while still maintaining the reliability benefits of magnetic coupling.
3Reliability
If magnetically permeable members are coated with insulating material, then electrical isolation is improved, but fabrication complexity increases
Solution Approach 1:
The patent extracts the insulating coating from the magnetically permeable members, eliminating the need for this additional fabrication step. Instead, electrical isolation is achieved through the geometric configuration of the coupler component and the positioning of floating coupler pads, which physically prevent direct electrical contact without requiring insulating coatings on the magnetic members.
4Loss of energy
If floating coupler pads are used to isolate current, then leakage reduction is achieved, but device complexity increases
Solution Approach 1:
The floating coupler pads serve multiple functions: they provide electrical isolation between high and low voltage components, they facilitate magnetic coupling for signal transfer, and they simplify the overall structure by eliminating the need for insulating coatings. This multi-functionality reduces the need for additional components and simplifies the device architecture while achieving leakage current reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively isolates the coupler pads from direct current, reducing leakage current and improving the efficiency of signal transfer between high and low voltage components, while also simplifying fabrication by eliminating the need for insulating coatings on the magnetically permeable members.
Implementation Method 1
a coupler component attached to a first magnetically permeable member... The first die and the second die are electrically coupled to the coupler component
Implementation Method 2
a first magnetically permeable member being attached to a first coupler pad and a second coupler pad
Data Source
AI summary
A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.