Floating Die Pad Isolation Layout for Semiconductor Dielectric Strength
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Solution Overview
Problem
Semiconductor devices used in inverters for electric vehicles and home appliances face dielectric breakdown risks due to voltage differences between control and drive elements, which existing insulating elements struggle to address effectively.
Innovation Solution
A semiconductor device configuration with a third die pad that electrically floats between the first and second die pads, where an insulating element of either inductive or capacitive type is mounted, utilizing a bonding layer and sealing resin to enhance dielectric strength by reducing potential differences and preventing charged carrier movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating element is provided between the conductive path to the control element and the conductive path to the drive element, then the dielectric strength is improved, but the insulating element has a high risk of dielectric breakdown when there is a significant difference in source voltage
Solution Approach 1:
The patent divides the insulating structure into multiple layers: a first insulating layer between the first die pad and third die pad, and a second insulating layer between the second die pad and third die pad. This segmentation allows each insulating layer to handle a portion of the voltage difference, reducing the stress on any single insulating element and preventing dielectric breakdown.
Solution Approach 2:
The third die pad acts as an intermediary element between the first and second die pads. By introducing this intermediate conductive member with different potential, the patent creates a gradual potential transition zone that reduces the electric field intensity across the insulating layers, thereby preventing dielectric breakdown while maintaining dielectric strength.
2Reliability
If the insulating element is mounted on a die pad, then the dielectric strength is improved, but the configuration increases device complexity
Solution Approach 1:
The patent merges the insulating element with the bonding layer by forming the first and second insulating layers as part of the bonding process between die pads and the third die pad. This integration combines the functions of bonding and insulation into a single structural element, reducing device complexity while maintaining dielectric strength.
Solution Approach 2:
The third die pad serves multiple functions: it acts as a conductive member for electrical connection, provides a mounting substrate for the insulating element, and creates potential difference zones for electric field management. This multi-functionality reduces the need for separate components, thereby reducing device complexity while achieving the required dielectric strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively improves dielectric strength between the insulating element and semiconductor elements, preventing dielectric breakdown and maintaining operational reliability across varying voltages.
Implementation Method 1
an insulating element that insulates the first semiconductor element and the second semiconductor element from each other
Data Source
AI summary
A semiconductor device includes: a plurality of conductive members including a first die pad and a second die pad that are spaced apart from each other; a first semiconductor element mounted on the first die pad; a second semiconductor element mounted on the second die pad; and an insulator that is electrically connected to the first semiconductor element and the second semiconductor element, and that insulates the first semiconductor element and the second semiconductor element from each other. The plurality of conductive members include a third die pad spaced apart from the first die pad and the second die pad. The insulator is mounted on the third die pad.