Spring-Loaded Floating Heat Pipe Interface for Modular Electronics
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Solution Overview
Problem
Modular electronic devices face challenges in thermal management as the physical mounting of heat pipes to heat-generating components becomes infeasible due to their modular design, which requires reconfiguration for different operating parameters.
Innovation Solution
A modular electronic device system that incorporates a primary electronics assembly with module bays and pluggable electronics modules, utilizing a spring-loaded floating heat pipe interface to maintain contact between heat conduction risers and floating heat sinks via heat pipes, allowing for efficient thermal conductivity and accommodation of dimensional variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat pipes are physically mounted to heat-generating components, then heat dissipation efficiency is improved, but modular reconfigurability deteriorates
Solution Approach 1:
The thermal management system is divided into separate modular components: heat-generating modules can be independently removed and replaced without affecting the heat pipe and heat sink assembly. The heat pipe is permanently mounted to the heat sink in the base unit, while heat-generating components are housed in removable modules, allowing both efficient heat transfer and modular reconfigurability.
Solution Approach 2:
A thermal interface material or mechanism acts as an intermediary between the removable heat-generating module and the permanently mounted heat pipe. This intermediary enables thermal coupling during operation while allowing complete separation when modules are removed or replaced, resolving the conflict between maintaining thermal contact and enabling modular reconfiguration.
2Reliability
If heat pipes are rigidly fixed to components, then thermal contact stability is improved, but stress on heat pipes during module insertion increases
Solution Approach 1:
The heat pipe mounting system transitions from a rigid fixed connection to a dynamic compliant connection. The heat pipe is mounted with compliance elements that allow it to flex and adjust during module insertion, accommodating dimensional variations while maintaining stable thermal contact. This dynamic design reduces stress concentrations that would occur with rigid fixation.
Solution Approach 2:
Compliant mounting elements are pre-installed on the heat pipe to cushion and absorb insertion forces before they can damage the heat pipe. These cushioning elements deform during module insertion to accommodate tolerances and prevent excessive stress, protecting the heat pipe from damage while ensuring reliable thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation from modular electronic devices by maintaining a direct thermal conductive path between heat-generating components and floating heat sinks, accommodating module insertion and thermal expansion while ensuring reliable contact and reduced stress on heat pipes.
Implementation Method 1
Heat pipes are devices which may be mounted directly to components that need to be cooled. Heat pipes represent one thermal management technology which may be used to efficiently transport heat away from such components to heat sinks
Implementation Method 2
a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the at least one floating heat sink
Implementation Method 3
the heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the spring loaded floating heat pipe interface and the at least one heat conduction riser
Implementation Method 4
Heat pipes represent one thermal management technology which may be used to efficiently transport heat away from such components to heat sinks, which can efficiently transfer that heat into the environment
Data Source
AI summary
Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.