Floating Heat Sink Mounting for PCB Cooling and Wiring Relief
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Solution Overview
Problem
The challenge is to effectively dissipate heat from semiconductor components on integrated circuit boards without increasing the layout and wiring complexity, while ensuring long-term reliability of the board.
Innovation Solution
A heat sink fixing structure and board-level heat dissipation apparatus are introduced, featuring a support structure with a first support member for the semiconductor component and a second support member for the heat sink, connected via a floating structure. This arrangement allows the heat sink to adapt to semiconductor components of different heights, reducing thermal resistance and stress on the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a heat sink covers a plurality of semiconductor components, then the number of openings on the integrated circuit board is reduced, but thermal resistance increases due to the need for heat conductive pads
Solution Approach 1:
The support structure is divided into a first support member for mounting semiconductor components and a second support member for mounting the heat sink, which are spatially separated and connected through the integrated circuit board. This segmentation allows each component to be optimally positioned without requiring multiple openings or heat conductive pads, thereby reducing both device complexity and maintaining effective heat dissipation.
Solution Approach 2:
The patent transitions from a planar arrangement where the heat sink directly covers semiconductor components to a three-dimensional arrangement where the first and second support members are spaced apart in the vertical dimension. This dimensional change enables the heat sink to be mounted on the back side of the board, eliminating the need for openings over the semiconductor components while maintaining thermal coupling through the board substrate.
2Reliability
If a heat sink is arranged corresponding to each semiconductor component, then heat dissipation is ensured, but the number of openings increases and layout and wiring difficulty increases
Solution Approach 1:
Multiple heat dissipation functions are merged into a single heat sink that is mounted on the second support member. This consolidated heat sink can dissipate heat from multiple semiconductor components simultaneously through the integrated circuit board, eliminating the need for individual heat sinks for each component and thereby reducing the number of openings and simplifying layout and wiring.
Solution Approach 2:
The second support member serves multiple functions: it provides mechanical support for the heat sink, enables thermal coupling between the heat sink and the integrated circuit board, and allows the heat sink to adapt to semiconductor components of different heights. This multi-functionality reduces the overall device complexity while ensuring effective heat dissipation.
3Stability of the object's composition
If the heat sink is fixed rigidly to the support structure, then structural stability is improved, but stress on the integrated circuit board increases
Solution Approach 1:
The connection between the first and second support members is designed to be flexible rather than rigid, allowing the structure to adapt to variations in semiconductor component heights and board deformations. This dynamic connection reduces stress concentration on the integrated circuit board while maintaining sufficient structural stability for effective heat dissipation.
Solution Approach 2:
The patent employs a flexible connection that changes its mechanical parameters (such as stiffness or mounting position) to accommodate different semiconductor component heights and board conditions. This parameter adjustment capability allows the heat sink to maintain optimal thermal contact while minimizing stress on the integrated circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the number of openings required on the integrated circuit board, simplifying layout and wiring, while ensuring efficient heat dissipation and improving the long-term reliability of the board by adapting to components of varying heights.
Implementation Method 1
the heat sink dissipates heat for semiconductor components
Implementation Method 2
the heat sink dissipates heat for semiconductor components
Data Source
AI summary
Disclosed are a heat sink fixing structure and a board-level heat dissipation apparatus. The heat sink fixing structure comprises a support structure and a floating structure; the support structure comprises a first support member for providing support for the semiconductor component and a second support member spaced apart from the first support member; the heat sink is arranged corresponding to the semiconductor component and is connected to the second support member in a floating configuration, making it adaptable to semiconductor components of different heights and tolerances, effectively reducing the temperature of semiconductor components and improving long-term reliability. By using the first and second support members to respectively support the heat sink and semiconductor components, the number of openings near the semiconductor component on the integrated circuit board is reduced, thereby reducing the wiring difficulty of the integrated circuit board and reducing the stress it bears.