Floating Heat Spreader With Vapor Chamber for ADSC Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Automated driving system computers (ADSCs) face challenges in thermal management due to increased heat generation from processing loads, exacerbated by harsh environmental conditions and inefficiencies in thermal interface gaps, which can lead to damage and reduced heat transfer efficiency.
Innovation Solution
A spring-loaded heat spreader is introduced between ADSC components and a cold plate, distributing heat in-plane to a larger area for improved conduction and incorporating vapor chambers and heat pipes to enhance thermal management, particularly in limited thickness environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional thermal interface is used between processor and cold plate, then the structure is simple, but heat transfer efficiency is reduced due to thermal interface gaps
Solution Approach 1:
A heat spreader is introduced as an intermediary component between the processor and cold plate. This heat spreader includes a vapor chamber that actively manages thermal interface gaps by using phase change (evaporation and condensation of working fluid) to bridge the gap and improve heat transfer efficiency, rather than relying on passive thermal interface materials alone.
Solution Approach 2:
The vapor chamber utilizes phase transitions of a working fluid (liquid to vapor and back to liquid) to transfer heat across the thermal interface gap. The working fluid evaporates at the hot surface to absorb heat and condenses at the cold surface to release heat, effectively bridging thermal gaps and improving heat transfer efficiency.
2Productivity
If processing load is increased for autonomous vehicle computation, then computational capability is improved, but heat generation increases causing thermal management challenges
Solution Approach 1:
The heat spreader distributes heat laterally across a larger surface area of the cold plate, transitioning from point-contact heat transfer to area-contact heat transfer. This dimensional expansion of heat distribution improves thermal management capability to handle increased heat generation from higher processing loads.
3Reliability
If thermal interface gap is reduced for better heat transfer, then heat transfer efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The vapor chamber's phase change mechanism is tolerant of larger thermal interface gaps compared to direct thermal contact methods. The working fluid can traverse larger gaps through evaporation and condensation cycles, reducing the stringency of manufacturing precision requirements for interface gap control while maintaining effective heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly increases heat transfer efficiency by optimizing contact area and reducing thermal resistance, effectively managing heat dissipation and preventing damage to ADSC components while operating in harsh conditions.
Implementation Method 1
distributing heat in-plane to a larger area for improved conduction
Implementation Method 2
incorporating vapor chambers and heat pipes to enhance thermal management
Implementation Method 3
incorporating vapor chambers and heat pipes to enhance thermal management
Data Source
AI summary
An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.