Floating Heat Sink Modules for Uneven Chip Height Cooling
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Solution Overview
Problem
Existing heat sinks struggle to efficiently dissipate heat from chips and components with varying heights on a circuit board due to complex conduction structures and potential damage from uneven pressure.
Innovation Solution
A split-type heat sink design with separate first and second heat dissipation modules and a heat dissipation base, allowing for floating fixation and improved thermal contact, utilizing liquid cooling structures and flexible connectors for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an integral cold plate is used to take away heat from chips and auxiliary devices, then heat dissipation can be achieved, but the heat conduction structure becomes complex and it is difficult to implement efficient heat dissipation due to varying mounting heights of chips and components
Solution Approach 1:
The heat sink is divided into multiple independent heat dissipation modules (first heat dissipation module for CPU, second heat dissipation module for GPU, third heat dissipation module for auxiliary devices) instead of using a single integral cold plate. Each module can be independently adjusted to match the mounting height of different components, simplifying the heat conduction structure while improving heat dissipation efficiency.
2Temperature
If an integral cold plate is used to synchronously take away heat from multiple chips and components, then heat dissipation coverage is improved, but uneven pressure may cause damage to components due to varying mounting heights
Solution Approach 1:
Each heat dissipation module is designed with adjustable mounting structures that can dynamically adapt to the varying mounting heights of different components. The modules can be independently positioned and secured at optimal heights, ensuring uniform pressure distribution across all contact surfaces and preventing component damage while maintaining comprehensive heat dissipation coverage.
3Temperature
If separate heat dissipation modules are used for chips with different heights, then heat dissipation efficiency is improved, but the structure becomes more complex
Solution Approach 1:
Multiple heat dissipation modules are merged into a unified heat sink structure that shares common mounting interfaces and thermal management features. The modules are designed with standardized connection mechanisms that simplify assembly while maintaining the ability to independently adjust for different component heights, thus improving heat dissipation efficiency without proportionally increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency while avoiding damage to components by adjusting pressure and accommodating varying component heights without occupying additional circuit board space.
Implementation Method 1
a first heat dissipation module in thermal contact with the first heat source; a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base
Implementation Method 2
both liquid cooling structures... The first heat dissipation module includes a cover plate, a cooling cavity, and a cooling plate... configured to connect to an external working substance circulation system
Data Source
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AI summary
A heat sink is used in an electronic device. The electronic device includes a first heat source and a second heat source that are disposed on a circuit board. The heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source. The present invention further provides an electronic device. The heat sink has a simple structure, is convenient to assemble, and can effectively improve heat dissipation efficiency.