Floating Secondary-Side Heatsink for Dense PCB Thermal Control
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Solution Overview
Problem
The challenge in thermal management of high-density networking, computing, and storage hardware is exacerbated by the limited space on the secondary side of Printed Circuit Board Assemblies (PCBAs), where components like Ball Grid Array (BGA) and optical modules generate significant heat.
Innovation Solution
The implementation of a secondary side heatsink, which can be either a floating heatsink or a coin-style heatsink with adjustable height, is used to manage thermal issues on the space-constrained secondary side. This heatsink is designed to provide consistent thermal management by applying spring force to components on the secondary side, or by extending to optical components on the primary side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If components are mounted on the secondary side of the PCBA to increase component density, then the component placement capacity is improved, but the thermal management capability deteriorates due to space constraints
Solution Approach 1:
The patent transitions from conventional primary-side heatsink placement to secondary-side heatsink placement, utilizing the previously underutilized secondary side space of the PCBA. This dimensional shift allows thermal management components to be positioned where space is available, resolving the conflict between component density and thermal management capability.
Solution Approach 2:
The patent divides the thermal management function into separate primary-side and secondary-side heatsinks. The secondary-side heatsink specifically targets components mounted on the secondary side, allowing independent optimization of thermal management for different component locations without interfering with primary-side component placement.
2Temperature
If a secondary side heatsink is implemented to manage thermal issues, then the thermal management capability is improved, but the device complexity increases
Solution Approach 1:
The secondary-side heatsink is designed to serve multiple functions: it provides thermal management for secondary-side components (such as BGAs) and can also extend to cool primary-side optical components. This multi-functionality reduces the need for separate dedicated heatsinks for each component type, thereby managing complexity while maintaining thermal management capability.
Solution Approach 2:
The patent employs floating heatsink designs with spring mechanisms that automatically adjust to component positions and thermal expansion. This dynamic adaptation eliminates the need for complex fixed-position mounting systems, reducing device complexity while ensuring consistent thermal contact with varying component configurations.
3Stability of the object's composition
If floating heatsink with spring force is used on the secondary side, then the thermal contact consistency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the mounting parameters from rigid fixed-position attachment to spring-based force application. By controlling the spring force parameters rather than precise positional parameters, the system achieves consistent thermal contact through force normalization rather than positional precision, thereby reducing manufacturing precision requirements while maintaining contact consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The secondary side heatsink effectively dissipates heat from high-power components on the secondary side, even in space-restricted environments, while also providing thermal management for optical components on the primary side, thus enhancing the overall thermal efficiency of the hardware platform.
Implementation Method 1
The floating heatsink can be connected through the printed circuit board assembly to the primary side via a compact wave spring
Implementation Method 2
a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side
Implementation Method 3
The secondary side heatsink effectively dissipates heat from high-power components on the secondary side
Data Source
AI summary
A module for use in a hardware platform for networking, computing, or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side has greater vertical clearance than the secondary side; at least one component mounted on the secondary side, the at least one component being placed on the secondary side due to an increased complexity and component density on the printed circuit board assembly preventing its placement on the primary side; and a floating heatsink assembly disposed on the secondary side to dissipate heat from the at least one component, the floating heatsink assembly being biased against the at least one component by at least one resilient member arranged within a limited vertical space on the secondary side.