Floating Liquid Metal Interface Structure for IC Package Thermal Stress
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Solution Overview
Problem
Current thermal interface materials in integrated circuit devices face challenges with thermal resistance variability, material failure modes due to thermo-mechanical stresses, and the need for costly gold plating and specialized tooling, which can lead to ineffective heat dissipation and potential damage from 'hot spots' in multi-device packages.
Innovation Solution
A thermal interface structure using a thermally conductive substrate with liquid metal layers on either side, allowing for improved thermal contact and reduced stress through the 'floating' of the substrate between the integrated circuit device and the heat dissipation device, thereby enhancing heat dissipation and reducing the risk of material failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder-based thermal interface materials are used, then thermal resistance performance is improved, but manufacturing complexity and cost increase due to required flux, backside metallization, and gold plating
Solution Approach 1:
The patent extracts and eliminates the complex metallization and plating processes from the thermal interface material application. By using a thermal interface material that adheres directly to the integrated circuit device surface without requiring backside metallization or gold plating, the manufacturing process is simplified while maintaining effective thermal contact.
Solution Approach 2:
The patent employs a cost-effective thermal interface material that eliminates the need for expensive gold plating and complex metallization layers. The material is applied directly and provides sufficient thermal performance without requiring durable metallization structures, reducing overall manufacturing cost.
2Stability of the object's composition
If rigid thermal interface materials are used, then structural stability is improved, but thermal contact effectiveness deteriorates under thermo-mechanical stress and warpage
Solution Approach 1:
The patent employs a compliant thermal interface material that can dynamically adapt its shape and thickness to accommodate warpage and dimensional changes in the integrated circuit device during thermal cycling. This dynamic compliance ensures continuous effective thermal contact between the heat dissipation device and the integrated circuit device surface, maintaining thermal reliability under varying conditions.
Solution Approach 2:
The patent changes the physical parameters of the thermal interface material by selecting a compliant material with appropriate viscosity and adhesion characteristics. This material can flow and conform to surface irregularities and warpage, then maintain stable thermal contact under operational thermal and mechanical stresses, resolving the contradiction between structural stability and thermal contact effectiveness.
3Productivity
If thin bond line thickness is used, then heat dissipation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs a self-leveling thermal interface material that automatically adjusts its thickness during application to achieve optimal bond line thickness. The material's flow characteristics allow it to self-distribute and level out, eliminating the need for precise external control of bond line thickness during manufacturing while still achieving thin, efficient thermal contact paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal resistance and reduces stress, improving the reliability of heat dissipation in integrated circuit devices by using liquid metal layers with a thermally conductive substrate, which enhances thermal contact and maintains structural integrity, thus preventing material failure and ensuring effective heat removal.
Implementation Method 1
a first liquid metal layer between the at least one integrated circuit device and the first surface of the thermally conductive substrate, and a second liquid metal layer between the heat dissipation device and the second surface of the thermally conductive substrate
Implementation Method 2
A thermal interface structure using a thermally conductive substrate with liquid metal layers on either side, allowing for improved thermal contact
Data Source
AI summary
A thermal interface structure may be formed comprising a thermally conductive substrate having a first surface and an opposing second surface, a first liquid metal layer on the first surface of the thermally conductive substrate, and a second liquid metal layer on the second surface of the thermally conductive substrate. The thermal interface structure may be used in an integrated circuit assembly or package between at least one integrated circuit device and a heat dissipation device.