Floating Metal Patterns for Electromagnetic Wave Suppression
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Solution Overview
Problem
Existing electronic circuit apparatuses face challenges in suppressing electromagnetic waves, particularly in the high-frequency millimeter and submillimeter wave range, which affects both peripheral components and the circuits themselves, leading to increased complexity due to the need for additional components to mitigate these emissions.
Innovation Solution
The electronic circuit apparatus incorporates electrically floating metal patterns on the substrate, strategically positioned relative to the electronic circuits to scatter and control the emission patterns of electromagnetic waves, thereby reducing the horizontal gain and enhancing the vertical gain, without requiring ground connections or additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If additional components are added to suppress electromagnetic waves, then electromagnetic wave suppression effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent merges the electromagnetic wave suppression function with the substrate itself by forming metal patterns directly on the substrate. This integration eliminates the need for separate suppression components, thereby reducing device complexity while maintaining suppression effectiveness. The metal patterns are formed as part of the substrate structure, combining multiple functions into a single component.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for mounting electronic circuits and simultaneously acts as an electromagnetic wave suppression structure through the integrated metal patterns. This multi-functionality reduces the need for additional dedicated suppression components, addressing the contradiction between suppression effectiveness and device complexity.
2Object-affected harmful factors
If metal patterns are connected to ground, then electromagnetic wave suppression is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the ground connection requirement from the electromagnetic wave suppression mechanism. By making the metal patterns electrically floating rather than grounding them, the design eliminates the need for complex ground connection structures while maintaining suppression effectiveness through the floating potential effect.
Solution Approach 2:
The patent changes the electrical state parameter of the metal patterns from grounded (zero potential) to electrically floating (isolated potential). This parameter change simplifies the manufacturing process by eliminating ground connection requirements while maintaining the electromagnetic wave suppression function through the floating metal patterns' interaction with emitted waves.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses electromagnetic wave emissions in desired directions, simplifies the apparatus design by reducing the number of components, and allows for controlled electric field strength manipulation, thereby addressing the complexity and emission challenges in existing systems.
Implementation Method 1
strategically positioned relative to the electronic circuits to scatter and control the emission patterns of electromagnetic waves
Implementation Method 2
the metal pattern being provided so as to be in an electrically floating state
Data Source
AI summary
An electronic circuit apparatus according an aspect of the present disclosure includes a substrate, an electronic circuit disposed on the substrate, and metal patterns and formed on the same surface as a surface on which the electronic circuit is disposed, the metal patterns and being provided so as to be in an electrically floating state, in which the metal patterns and are disposed at places where they have a specified distance from the electronic circuit.