Floating Pad Metal Frame for Bonding Observation in Electronic Assemblies

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Solution Overview

Problem

The challenge in existing electronic devices is the difficulty in determining the appropriate bonding force for conductive particles in conductive glue, as the condition of the conductive particles between a solid conductive pad and electronic components is obscured by the glue, affecting electrical connection quality.

Innovation Solution

Incorporating a floating pad with a metal frame that defines an observation region, allowing for indirect observation of the bonding process, including the deformation of conductive particles and the surface characteristics of the insulating layer, to ensure proper bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive glue is used to bond electronic components to the circuit substrate, then electrical connection is achieved, but the condition of the conductive particles becomes difficult to observe directly

Engineering Contradiction:
Improveelectrical connection qualityVSAvoidvisibility of conductive particles
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent introduces a floating pad as an intermediary observation window between the conductive glue and the external environment. This floating pad allows optical observation of the conductive particles without interfering with the bonding process, solving the contradiction between achieving reliable electrical connection and enabling direct measurement of particle conditions.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the bonding force is increased to improve electrical connection, then particle deformation may occur, but it becomes difficult to determine the appropriate force

Engineering Contradiction:
Improvebonding strengthVSAvoidcontrol of bonding force
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The floating pad provides real-time visual feedback on the deformation state of conductive particles during the bonding process. By observing the particle morphology through the floating pad, operators can adjust the bonding force to achieve optimal compression without excessive deformation, thereby improving control over bonding precision.

Inventive Principle:
Principle #23Feedback

3Reliability

If conductive particles are compressed to enhance conductivity, then particle shape changes, but the compression status cannot be discerned through direct observation

Engineering Contradiction:
Improveelectrical conductivityVSAvoidobservation of particle compression
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The floating pad serves as an optical intermediary that enables direct visualization of conductive particle compression status. The transparent or translucent floating pad allows light to pass through, making the compressed particles visible for quality assessment without compromising the electrical connection reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12575396B2Electronic device including a conductive pad and a floating pad with a metal frame outlining an observation region
Publication Date: 2026.03.10 INNOLUX CORP
  • US12575396B2 patent drawing
  • US12575396B2 patent drawing
  • US12575396B2 patent drawing

AI summary

An electronic device is provided. The electronic device includes a substrate, a first conductive pad and a floating pad. The first conductive pad is disposed on the substrate. The floating pad is disposed on the substrate and adjacent to the first conductive pad. The floating pad includes a metal frame, and an inner edge of the metal frame defines an outline of an observation region. In addition, in a bottom-view diagram of the electronic device, the outline of the observation region has at least one arc-shaped edge.