Floating Pad Metal Frame for Bonding Observation in Electronic Assemblies
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Solution Overview
Problem
The challenge in existing electronic devices is the difficulty in determining the appropriate bonding force for conductive particles in conductive glue, as the condition of the conductive particles between a solid conductive pad and electronic components is obscured by the glue, affecting electrical connection quality.
Innovation Solution
Incorporating a floating pad with a metal frame that defines an observation region, allowing for indirect observation of the bonding process, including the deformation of conductive particles and the surface characteristics of the insulating layer, to ensure proper bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive glue is used to bond electronic components to the circuit substrate, then electrical connection is achieved, but the condition of the conductive particles becomes difficult to observe directly
Solution Approach 1:
The patent introduces a floating pad as an intermediary observation window between the conductive glue and the external environment. This floating pad allows optical observation of the conductive particles without interfering with the bonding process, solving the contradiction between achieving reliable electrical connection and enabling direct measurement of particle conditions.
2Reliability
If the bonding force is increased to improve electrical connection, then particle deformation may occur, but it becomes difficult to determine the appropriate force
Solution Approach 1:
The floating pad provides real-time visual feedback on the deformation state of conductive particles during the bonding process. By observing the particle morphology through the floating pad, operators can adjust the bonding force to achieve optimal compression without excessive deformation, thereby improving control over bonding precision.
3Reliability
If conductive particles are compressed to enhance conductivity, then particle shape changes, but the compression status cannot be discerned through direct observation
Solution Approach 1:
The floating pad serves as an optical intermediary that enables direct visualization of conductive particle compression status. The transparent or translucent floating pad allows light to pass through, making the compressed particles visible for quality assessment without compromising the electrical connection reliability.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a first conductive pad and a floating pad. The first conductive pad is disposed on the substrate. The floating pad is disposed on the substrate and adjacent to the first conductive pad. The floating pad includes a metal frame, and an inner edge of the metal frame defines an outline of an observation region. In addition, in a bottom-view diagram of the electronic device, the outline of the observation region has at least one arc-shaped edge.


