Floating Pad Semiconductor Package Layout for Electrical Isolation

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Solution Overview

Problem

Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.

Innovation Solution

The manufacturing process involves creating a substrate with grooves and floating pads supported by resin, allowing for efficient integration of electronic components and encapsulation, using etching and plating techniques to form conductive layers and isolate floating pads electrically.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and performance is low

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The substrate is divided into multiple regions including first grooves, second grooves, third grooves, and floating pads. This segmentation allows for optimized component placement and electrical isolation, reducing overall package size while maintaining manufacturing feasibility through modular structure design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention introduces a three-dimensional structure with grooves extending through the substrate thickness and floating pads positioned at different levels. This dimensional approach enables better space utilization and component integration, achieving smaller package size without proportionally increasing manufacturing complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If conventional packages are used, then manufacturing cost is lower, but reliability is decreased

Engineering Contradiction:

Improvepackage reliabilityVSAvoidmanufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Different regions of the substrate are assigned different functions: first grooves for component mounting, second grooves for resin filling and isolation, third grooves for additional isolation, and floating pads for electrical connections. This localized functional differentiation improves reliability by optimizing each region for its specific purpose while keeping the overall manufacturing process manageable.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Resin is introduced as an intermediary material filling the second grooves to provide electrical isolation between floating pads and substrate. This mediator enables reliable electrical isolation without requiring direct mechanical contact or complex isolation structures, maintaining manufacturing ease while improving reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If conventional packages are used, then manufacturing is easier, but performance is relatively low

Engineering Contradiction:

Improvedevice performanceVSAvoidstructure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The substrate serves multiple functions simultaneously: structural support, electrical isolation (through grooves and resin), component mounting platform, and electrical connection pathway (through floating pads). This multi-functionality improves device performance by integrating multiple subsystems into a single structure, reducing the need for additional components while managing structural complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the isolation function and connection function into a single integrated structure where floating pads are electrically isolated from the substrate by resin-filled grooves but remain capable of electrical connections. This merging of functions improves performance by reducing component count and interconnection complexity while managing overall structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces package size, enhances reliability, and improves performance by optimizing the electrical connections and protection of components within semiconductor devices.

Implementation Method 1

a resin in the first groove... wherein the floating pad is between the second groove and the third groove

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

providing a first groove at the second side of the substrate... providing a second groove in the substrate at the first side of the substrate

Methodology Applied

Scientific EffectEtching: Ablation

Implementation Method 3

using etching and plating techniques to form conductive layers

Methodology Applied

Scientific EffectPlating: Electrodeposition

Data Source

PatentUS12444669B2Semiconductor devices with floating pad and their methods of manufacturing

Publication Date: 2025.10.14 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device comprises a substrate comprising a first side and a second side opposite the first side, wherein the substrate comprises a first groove at the second side of the substrate, a first electronic component over the first side of the substrate, and a resin in the first groove. The substrate comprises a floating pad at the first side of the substrate, a second groove at the first side of the substrate, and a third groove at the first side of the substrate, wherein the floating pad is between the second groove and the third groove. Other examples and related methods are also disclosed herein.