Floating Patch PCB Antenna Layout for Warpage and Blistering
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Solution Overview
Problem
Existing millimeter wave antennas face issues with asymmetric copper foil distribution leading to deformation, warping, blistering, and reduced heat dissipation due to low copper foil filling factors, which are exacerbated by the use of thicker dielectric substrates and multi-layer designs, and are difficult to address with methods like metal side walls and electromagnetic band-gap structures.
Innovation Solution
The introduction of a multi-layer printed circuit board design featuring floating patches that fill the clearance area, maintaining a specific width and gap relative to the operating frequency, increasing the copper foil filling factor without affecting the antenna's operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thicker dielectric substrates or multi-layer substrates are used to manufacture antenna structures, then antenna radiation characteristics (bandwidth, gain, efficiency) are improved, but copper foil distribution becomes more asymmetric and uneven, causing deformation and warping
Solution Approach 1:
The patent applies local quality by strategically placing copper foils only in specific regions where they are needed to balance the overall copper distribution. Instead of uniform copper coverage, copper foils are localized in areas that compensate for the asymmetric copper distribution caused by the antenna structure, thereby preventing board deformation while maintaining antenna performance.
Solution Approach 2:
The patent deliberately introduces asymmetric copper foil placement to counterbalance the inherent asymmetry caused by the antenna structure. By placing copper foils asymmetrically in specific locations, the overall copper distribution is balanced, preventing warping and deformation while accommodating the antenna's structural requirements.
2Reliability
If clearance area is maintained between antenna structure and copper foil, then antenna radiation field pattern is preserved, but copper foil filling factor decreases, causing blistering due to excessive prepreg layer volume
Solution Approach 1:
The patent applies local quality by placing copper foils in specific localized regions within the clearance area, rather than uniformly filling it. This selective placement increases the copper foil filling factor in critical areas while maintaining the necessary clearance for antenna operation, thereby preventing blistering without compromising the radiation field pattern.
Solution Approach 2:
The patent uses partial filling of the clearance area with copper foils rather than complete filling. By placing copper foils partially in the clearance area, the copper filling factor is increased enough to prevent blistering while leaving sufficient space to maintain the antenna's radiation characteristics.
3Reliability
If clearance area is maintained between antenna structure and copper foil, then antenna structure interference is avoided, but surface metal area decreases, reducing heat dissipation performance
Solution Approach 1:
The patent applies local quality by strategically placing copper foils in specific regions of the clearance area where they can serve dual purposes: maintaining structural clearance for antenna operation and providing thermal pathways for heat dissipation. This localized copper placement optimizes both electromagnetic performance and thermal management.
Data Source
AI summary
An antenna apparatus includes a multi-layer printed circuit board, an antenna, and a floating patch group. The multi-layer printed circuit board includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer. The antenna is formed from at least one of the first metal layer, the second metal layer, and the third metal layer. The floating patch group is located in the multi-layer printed circuit board and includes a plurality of floating patches. The floating patch has a width. There is a gap between the floating patch and an adjacent floating patch. The floating patches have the same or similar width and the same or similar gap. The floating patch group is arranged in a metal layer where the antenna is located. There is a spacing between the floating patch group and the antenna.