Floating Potential IC Testing for Defect Detection

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Solution Overview

Problem

The existing testing method for integrated circuits, as standardized by the Automotive Electronics Council, is inadequate for detecting certain defects like crystal defects and aluminum spiking, leading to potential safety risks in vehicle electronics due to its dependency on the circuit structure and inability to differentiate between internal and external effects.

Innovation Solution

A testing method where a floating potential is applied to each signal terminal, allowing for increased independence from hardware-related loads and chip-internal states, with a single value of signal potential determined via simulation for analysis, and optionally applying a ground potential to a further ground terminal for more conclusive measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a ground potential is applied to all other signal terminals according to the standard testing method, then the testing procedure is simple and standardized, but the characteristic curve becomes barely dependent on the circuit structure, making it unsuitable for detecting crystal defects and aluminum spiking

Engineering Contradiction:
Improvetesting procedure simplicityVSAvoiddefect detection capability
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent changes the potential parameter from ground potential (0V) to floating potential for signal terminals. This parameter change makes the characteristic curve dependent on the circuit structure, enabling detection of crystal defects and aluminum spiking while maintaining testing simplicity through automated potential application.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If the standard testing method is used, then the testing process is straightforward, but it shows high dependency on hardware-related loads and chip-internal states, reducing independence from external effects

Engineering Contradiction:
Improvetesting process complexityVSAvoidindependence from hardware loads and chip states
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent introduces a floating potential as an intermediary that isolates the measurement from direct dependency on hardware loads and chip-internal states. This intermediary potential allows the measurement to reflect intrinsic circuit characteristics rather than being influenced by external loading conditions or pre-charged nodes.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If floating potential is applied to each further signal terminal, then independence from hardware-related loads and chip-internal states is increased, but the testing setup becomes more complex

Engineering Contradiction:
Improveindependence from hardware loads and chip statesVSAvoidtesting setup complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a universal testing approach where the same floating potential application method works for all signal terminals regardless of their specific circuit connections or load conditions. This multi-functional testing capability achieves independence from hardware loads while using a standardized procedure that doesn't significantly increase setup complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS7768289B2Testing method and testing device for an integrated circuit
Publication Date: 2010.08.03 ROBERT BOSCH GMBH
  • US7768289B2 patent drawing
  • US7768289B2 patent drawing

AI summary

A testing method for an integrated circuit which has at least one ground terminal and multiple signal terminals, a signal potential being applied to a signal terminal and a ground potential being applied to the at least one ground terminal. A floating potential is applied to each further signal terminal. The testing method is suitable to detect more defects than a standard testing method of the Automotive Electronics Council.