Floating Reinforcement in Redistribution Packaging Against Delamination
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller, faster, and more efficient packaging techniques due to issues like crack and delamination in redistribution circuit structures during de-bonding and dicing processes, which affect yield and reliability.
Innovation Solution
The implementation of reinforcement structures, such as reinforcement pattern layers and vias, embedded within the redistribution circuit structure to enhance structural rigidity and prevent cracking, combined with a manufacturing process that includes de-bonding and dicing stages where these structures mitigate stress and delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the redistribution circuit structure is made thinner to achieve smaller packaging, then the packaging size is reduced, but the structure becomes more prone to cracking and delamination during de-bonding and dicing
Solution Approach 1:
The patent employs composite material structures by integrating reinforcement pattern layers (conductive or non-conductive) within the redistribution circuit structure. These reinforcement layers are embedded between dielectric layers to create a composite structure that maintains thin overall profile while providing enhanced mechanical strength and stress distribution to prevent cracking during de-bonding and dicing processes
Solution Approach 2:
The redistribution circuit structure is segmented into multiple thin dielectric layers with reinforcement pattern layers interspersed between them. This segmentation allows the structure to maintain thinness for miniaturization while the distributed reinforcement layers provide localized strength support throughout the structure, preventing catastrophic failure during processing
2Strength
If reinforcement structures are added to prevent cracking, then structural integrity is improved, but the device complexity increases
Solution Approach 1:
The reinforcement pattern layers serve multiple functions simultaneously: they provide mechanical strength to prevent cracking, act as electrical connection pathways (when conductive), and serve as structural support during de-bonding and dicing. This multi-functionality reduces the need for separate reinforcement components, thereby limiting the increase in device complexity while maintaining structural integrity
Solution Approach 2:
The patent merges the reinforcement function with the existing circuit pattern layers by using the same conductive or non-conductive material layers for both structural support and electrical routing purposes. This consolidation integrates the reinforcement function into the existing device architecture rather than adding separate components, thus improving structural integrity with minimal increase in overall complexity
Data Source
AI summary
A package structure includes a redistribution circuit structure, a wiring substrate, a semiconductor device, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has dielectric layers. The wiring substrate is disposed on the redistribution circuit structure. The semiconductor device is disposed on the redistribution circuit structure opposite to the wiring substrate. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure is partially embedded in the redistribution circuit structure and is partially embedded in the insulating encapsulation. The reinforcement structure includes reinforcement pattern layers and reinforcement vias. The reinforcement pattern layers and the dielectric layers are stacked alternately. The reinforcement vias penetrate through the dielectric layers to connect the reinforcement pattern layers. The reinforcement structure is electrically floating.