Floating Substrate Capacitor for 3D IC Noise Mitigation
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Solution Overview
Problem
The coupling capacitance in 3D IC structures with floating substrates leads to significant cross-talk effects due to electrical signal interconnections, necessitating a solution to mitigate noise interference.
Innovation Solution
Incorporating a grounded capacitor connected to the floating substrate or a conductive piece spaced from the substrate to form a capacitor, which helps in noise signal discharge and reduces impedance, thereby minimizing the impact on electrical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If interconnections are added to the floating substrate for conducting electrical signals, then the electrical connectivity is improved, but coupling capacitance is generated causing cross-talk effects
Solution Approach 1:
A grounded capacitor is introduced as an intermediary component between the floating substrate and ground. This capacitor acts as a mediator that provides a controlled path for noise discharge, allowing the interconnections to function while mitigating the harmful coupling capacitance effects through the grounding mechanism
2Object-affected harmful factors
If a grounded capacitor is connected to the floating substrate to discharge noise signals, then the noise impact is reduced, but the device complexity increases
Solution Approach 1:
The grounded capacitor serves multiple functions simultaneously: it provides a discharge path for noise signals, stabilizes the floating substrate potential, and can be integrated with existing interconnection structures. This multi-functionality reduces the need for additional separate noise mitigation components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces noise signal impact on electrical devices within the semiconductor structure, improving RLC characteristics and reducing error rates in capacitance measurements, thus enhancing the overall performance of the semiconductor structure.
Implementation Method 1
a capacitor grounded and connected to the floating substrate
Implementation Method 2
grounding a formed capacitor to discharge therethrough the noise signal
Data Source
AI summary
A semiconductor structure is provided. The semiconductor structure includes a floating substrate; and a capacitor grounded and connected to the floating substrate. A method of manufacturing a semiconductor structure is also provided.