Floating Support Structure for Tolerance-Compensated Chip Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat dissipation solutions for high-power electronic components in intelligent vehicle systems, such as autonomous driving chips, face challenges with high thermal resistance and dimension chain tolerance issues, leading to inadequate heat dissipation and potential corrosion risks, especially in environments requiring IP67 standards.
Innovation Solution
The implementation of a floating support structure within the electronic device, which includes a housing assembly, circuit board, and a floating support assembly that applies a pre-loading force to ensure the electronic component abuts against the housing assembly, thereby enhancing heat dissipation and compensating for dimension chain tolerance without increasing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thermally conductive material layer is used to compensate for dimension chain tolerance, then the tolerance issue is addressed, but the thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
A floating support assembly is introduced as an intermediary component between the circuit board and the electronic component. This assembly includes elastic support pieces that apply pre-loading force to ensure intimate contact between the electronic component and housing assembly, eliminating the need for thick thermally conductive material layers while maintaining both tolerance compensation and heat dissipation performance
Solution Approach 2:
The floating support assembly employs elastic support pieces that can dynamically adjust to dimensional variations. The elastic components provide continuous contact pressure to maintain intimate thermal contact between the electronic component and housing assembly, adapting to manufacturing tolerances without requiring excessive material thickness
2Manufacturing precision
If the thickness of thermally conductive material layer is increased to accommodate tolerance, then dimension chain tolerance is compensated, but thermal resistance increases and heat dissipation capability decreases
Solution Approach 1:
The floating support assembly acts as a mediator that provides mechanical compliance through elastic support pieces. These pieces ensure consistent contact pressure between the electronic component and housing assembly, eliminating the need for thick thermally conductive material while maintaining both tolerance compensation and thermal contact quality
Solution Approach 2:
The invention changes the parameter of contact pressure by introducing pre-loading force through elastic support pieces. This ensures intimate thermal contact between surfaces, allowing for thin thermally conductive material layers while maintaining effective heat dissipation despite manufacturing tolerances
3Temperature
If traditional heat dissipation solutions are used, then heat dissipation is provided, but corrosion risk increases in IP67 environments
Solution Approach 1:
The invention merges the heat dissipation function with the structural support function into a single integrated housing assembly. The electronic component directly contacts the housing assembly which serves both as a mechanical support structure and a heat dissipation path, eliminating the need for separate corrosion-prone heat dissipation components in IP67 environments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal resistance and improves heat dissipation for high-power electronic components, while meeting dustproof and anti-corrosion requirements, including IP67 standards, and offers flexible layout options and cost-effective design.
Implementation Method 1
a floating support assembly that applies a pre-loading force to the electronic component or the circuit board through elastic support pieces
Implementation Method 2
the electronic component abuts against the housing assembly under an action of a pre-loading force of the floating support assembly, to implement heat dissipation of the electronic component through the housing assembly
Data Source
AI summary
An electronic device includes a housing assembly, a circuit board, an electronic component, and a floating support assembly that are assembled together. Installation space is formed in the housing assembly. The circuit board, the electronic component, and the floating support assembly are all accommodated in the installation space. The circuit board is installed in the housing assembly. The electronic component is supported by the circuit board and is in signal communication with the circuit board. The floating support assembly is disposed on the circuit board to support the electronic component or disposed in the housing assembly to support the circuit board, so that the electronic component abuts against the housing assembly under an action of a pre-loading force of the floating support assembly.