Enclosed Floodlight Heat Sink With Active Thermal Power Control

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Solution Overview

Problem

Floodlights face inefficiencies in heat transfer and safety risks due to poor heat dissipation characteristics of exposed heat sinks, which fail to maintain temperature thresholds for temperature-sensitive components, posing ergonomic hazards.

Innovation Solution

The implementation of a fully enclosed heat sink system with thermistors to actively monitor temperature profiles and adjust power consumption, ensuring that thermal zones remain within prescribed limits by using a combination of conduction, convection, and radiation heat transfer mechanisms.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an exposed heat sink is used to transfer heat from LEDs and PSUs, then heat dissipation is achieved, but the heat transfer effectiveness is poor and safety risks increase due to exposed hot surfaces

Engineering Contradiction:
Improveheat dissipation effectivenessVSAvoidsafety risk from exposed hot surfaces
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies nesting by placing the heat sink inside an enclosed housing structure. The heat sink is positioned within a sealed compartment that contains the LED array and power supply units, allowing heat transfer to the housing walls while preventing direct exposure of hot surfaces to users. This nested configuration maintains thermal management effectiveness while eliminating safety hazards from exposed hot components.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent uses the housing structure as an intermediary between the heat-generating components and the external environment. Heat is transferred from the LEDs and PSUs to the housing walls, which then dissipate heat to the surrounding air through controlled surfaces. This intermediary approach allows effective heat transfer while the housing acts as a thermal barrier protecting users from direct contact with hot components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If surface treatments are applied to improve heat transfer characteristics of the heat sink, then radiation and convection improve, but manufacturing cost increases and safety risks remain unaddressed

Engineering Contradiction:
Improveheat transfer characteristicsVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent segments the thermal management function across multiple components: the heat sink for direct heat absorption, the enclosed housing structure for heat distribution, and controlled vent surfaces for heat dissipation. This segmentation allows each component to be optimized independently using standard manufacturing processes, avoiding the need for expensive specialized surface treatments while achieving effective heat transfer.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The housing structure serves multiple functions: it provides mechanical protection for internal components, acts as a heat transfer medium, and functions as the external surface for heat dissipation. This multi-functionality eliminates the need for separate expensive surface treatments on the heat sink, as the housing itself performs the heat transfer function with standard surfaces.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If air pockets surround the PSUs for heat transfer, then heat dissipation occurs, but convection heat transfer is impeded due to physical properties of air

Engineering Contradiction:
Improveheat dissipation from PSUsVSAvoidconvection heat transfer efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent introduces thermal interface materials as intermediaries between the PSUs and the housing structure. These materials fill air pockets and provide continuous thermal pathways, replacing inefficient air convection with superior solid-phase heat conduction. The thermal interface material ensures effective heat transfer from the PSUs to the housing walls without relying on slow air convection processes.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Adaptability or versatility

If multiple heat-generating subsystems (PSUs and LEDs) are included in the floodlight, then functionality is enhanced, but total heat load increases to up to 25 Watts requiring more effective heat management

Engineering Contradiction:
Improvefunctionality of floodlightVSAvoidtotal heat load
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent merges the thermal management of multiple heat-generating subsystems into a unified system. The enclosed housing structure serves as a common heat transfer medium for both the LED arrays and power supply units. Heat from all sources is conducted to the housing walls, which dissipate the combined heat load, simplifying thermal management while supporting enhanced functionality.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This active thermal-control system effectively maintains temperature thresholds, enhancing safety and efficiency by reducing power consumption and preventing overheating, thus addressing both performance and safety concerns.

Implementation Method 1

transfer heat from the array of LEDs to the housing component for external dissipation

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

transfer heat from the array of LEDs to the housing component for external dissipation

Methodology Applied
Scientific EffectHeat convection: Convection

Implementation Method 3

transfer heat from the array of LEDs to the housing component for external dissipation

Methodology Applied
Scientific EffectHeat radiation: Thermal Radiation

Implementation Method 4

A thermal interface material (TIM) is located between the PCB and a pedestal of the heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 5

using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight

Methodology Applied
Scientific EffectThermal resistance: Thermistor

Implementation Method 6

the floodlight may include a heat sink to radiate and/or convect heat from the LEDs

Methodology Applied
Scientific EffectHeat radiation: Thermal Radiation

Implementation Method 7

the floodlight may include a heat sink to radiate and/or convect heat from the LEDs

Methodology Applied
Scientific EffectHeat convection: Convection

Data Source

PatentUS11867386B2Active thermal-control of a floodlight and associated floodlights
Publication Date: 2024.01.09 GOOGLE LLC
  • US11867386B2 patent drawing
  • US11867386B2 patent drawing
  • US11867386B2 patent drawing

AI summary

This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.