Floodlight Thermal Control With Enclosed Heat Sink and PSU Cooling
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Solution Overview
Problem
Existing floodlight heat-transfer systems are neither effective nor efficient in maintaining temperatures of devices within allowable operating-temperature thresholds, and they pose an ergonomic safety risk due to exposed heat sinks and poor heat-transfer characteristics.
Innovation Solution
The implementation of an active thermal-control system for floodlights, which includes a fully enclosed heat sink for LEDs and a separate heat-transfer subsystem for power supply units (PSUs), along with thermistors to monitor temperature profiles and adjust power consumption accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an exposed heat sink is used for LED heat dissipation, then heat transfer area is increased, but safety risk increases due to exposed hot surfaces and heat transfer efficiency deteriorates due to poor radiation and convection characteristics
Solution Approach 1:
The heat sink is fully enclosed within the housing component, with the housing serving as an outer shell that contains the heat sink. This nesting arrangement allows the heat sink to maintain its heat dissipation function while being protected from direct exposure, eliminating the safety risk of exposed hot surfaces.
Solution Approach 2:
The housing component acts as an intermediary between the heat sink and the external environment. It provides thermal conduction pathways while physically enclosing the heat sink, mediating the heat transfer process and preventing direct contact with hot surfaces.
2Reliability
If air pockets surround the power supply units, then device protection is improved, but convection heat transfer from the PSUs is impeded
Solution Approach 1:
Thermal interface material is introduced as an intermediary substance between the power supply units and the housing component. This material fills the air pockets and provides a continuous thermal conduction pathway, replacing the ineffective air convection with efficient solid-to-solid thermal conduction.
Solution Approach 2:
The thermal interface material changes the thermal conduction parameter between the PSU and housing, transforming the heat transfer mechanism from air convection (inefficient) to solid-to-solid conduction (efficient), while maintaining the protective enclosure.
3Temperature
If surface treatments are applied to improve heat transfer characteristics, then heat transfer efficiency is improved, but manufacturing cost increases and safety risk remains unaddressed
Solution Approach 1:
The housing component encloses the heat sink, creating a nested structure where the housing serves as both protective enclosure and thermal management component. This eliminates the need for additional surface treatments on the heat sink while maintaining effective heat transfer.
Solution Approach 2:
The housing component performs multiple functions: it provides mechanical protection, structural support, and thermal conduction pathways. By making the housing multi-functional, the patent eliminates the need for separate surface treatment processes, reducing manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains thermal zones within prescribed temperature thresholds, enhancing the efficiency of heat dissipation and reducing safety risks by actively controlling temperature through power adjustments.
Implementation Method 1
a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight
Implementation Method 2
using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight
Implementation Method 3
the heat sink may have an exposed, polished surface that has poor radiation and/or poor convection heat-transfer characteristics
Implementation Method 4
the heat sink may have an exposed, polished surface that has poor radiation and/or poor convection heat-transfer characteristics
Data Source
AI summary
This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.