Floor Board Relief Patterning Without Embossed Press Tools
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Solution Overview
Problem
Existing manufacturing methods for floor boards require expensive embossed press plates or rollers under high pressure, limiting flexibility and increasing costs for creating varied relief patterns.
Innovation Solution
A method involving digitally controlled non-contact printing of a curable or surface removing substance onto a panel, followed by curing or surface removal, allowing for quick pattern changes without the need for high-pressure embossed tools, and enabling a high degree of variation in relief patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If expensive embossed press plates or rollers under high pressure are used to create embossed surface, then the relief pattern can be formed, but the manufacturing cost increases and flexibility for pattern variations is limited
Solution Approach 1:
The patent replaces the mechanical embossing system (press plates, rollers, high pressure) with a digital printing system that deposits curable substance in predefined patterns. This substitution eliminates the need for expensive embossing tools while enabling flexible pattern variations through digital control, directly resolving the contradiction between manufacturing cost and pattern flexibility.
Solution Approach 2:
The patent changes the fundamental parameter of pattern creation from mechanical deformation (embossing) to chemical deposition (printing curable substance). This parameter change allows for cost reduction by eliminating mechanical tools and enables unlimited pattern variations through digital programming, addressing both aspects of the technical contradiction.
2Productivity
If embossed press plates or rollers are used to create relief patterns, then the pattern can be formed, but the time required for pattern changes increases due to repetitive embossment requirements
Solution Approach 1:
The patent replaces time-consuming mechanical retooling (changing press plates or rollers) with instantaneous digital pattern reconfiguration. The printing system can switch between different relief patterns by simply changing the digital file, eliminating the time loss associated with physical tool changes while maintaining high production speed.
3Ease of manufacture
If high pressure is applied through embossed tools to create relief patterns, then the embossed surface is formed, but the device complexity and cost increase
Solution Approach 1:
The patent eliminates the complex mechanical embossing equipment (press plates, rollers, pressure mechanisms) by using a digital printing system that deposits material without requiring high pressure. This substitution dramatically simplifies the manufacturing process and reduces device complexity while achieving the same relief pattern effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the necessity for expensive embossed tools, enhances flexibility in producing customized floor boards, and allows for efficient production of unique designs tailored to individual customer preferences.
Implementation Method 1
curing the curable substance or removing any reaction products of the surface removing substance and the panel
Implementation Method 2
the curable substance may be cured by curing means, for example by means of UV radiation or a UV laser. Alternative curing means may comprise electron-beam heating, or normal heating at elevated temperature
Implementation Method 3
surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern
Data Source
AI summary
A method of manufacturing a floor board comprises the steps of supplying a panel, printing a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively, and curing the curable substance or removing any reaction products of the surface removing substance and the panel.