Floor Covering Electrical Component Adhesion and Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing floor coverings with embedded electrical components face damage during the application of hardenable materials and lack sufficient adhesion, leading to instability and potential mechanical impairment of the components.
Innovation Solution
Incorporating an adhesive layer below the electrical components, which can be continuous or partial, and using a reinforcing fabric to protect them, along with a carrier material to ensure secure attachment and mechanical resilience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrical components are embedded in hardenable material without adhesive layer, then manufacturing process is simple, but components can be damaged and lack sufficient adhesion
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the electrical component and the hardenable material. This adhesive layer serves as a mediator that provides secure bonding and protection to the electrical components during the manufacturing process and in the finished product, resolving the contradiction between manufacturing simplicity and component reliability.
Solution Approach 2:
The adhesive layer is applied beforehand to the electrical components or substrate before the hardenable material is introduced. This preliminary protective layer cushions and protects the electrical components from potential damage during the subsequent hardening process, ensuring their integrity while maintaining manufacturing efficiency.
2Device complexity
If electrical components are placed directly on substrate without adhesive, then device complexity is reduced, but components may lift off or float when curable material is applied
Solution Approach 1:
The adhesive layer acts as a mediating substance between the electrical components and the substrate, providing the necessary bonding force to prevent components from lifting off or floating when curable material is applied. This intermediary layer maintains component stability without significantly increasing overall device complexity.
3Reliability
If adhesive layer covers entire underbody, then component adhesion is maximized, but material usage and manufacturing complexity increase
Solution Approach 1:
Instead of applying adhesive uniformly across the entire underbody, the adhesive layer is applied locally only in the areas where electrical components are positioned. This localized approach maintains sufficient adhesion for component stability while reducing material usage and simplifying the manufacturing process.
Solution Approach 2:
The adhesive layer is applied partially rather than completely covering the entire substrate surface. This partial action provides adequate bonding for the electrical components without the excessive material usage and manufacturing complexity associated with full-surface adhesive application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable adhesion and protection of electrical components, maintaining their functionality and integrity by preventing damage during material hardening and usage, while also enhancing the floor's tensile strength and moisture resistance.
Implementation Method 1
Below the electrical component is an adhesive layer... the at least one electrical component, for example an electronic component and/or an electrical sensor conductor, is connected to the substrate by means of an adhesive
Implementation Method 2
a layer of a hardenable material which is hardened in the finished state of the floor covering
Implementation Method 3
the at least one electrical component... is embedded in a reinforcement fabric and in a layer of a hardenable material... the reinforcement fabric protects these components against mechanical influences
Data Source
Figure 1~2
Figure 3~4
Figure 5~7
AI summary
The invention relates to a floor covering (10) as a covering for a subfloor (20), wherein the floor covering (10) has a layer which is composed of a curable material (45) which is cured in the finished state of the floor covering (10) and into which a reinforcing fabric (30) and at least one electrical component (85) are embedded. It is provided that the at least one electrical component (85) is connected by way of its bottom side to a subfloor (20), in particular an unfurnished floor, by adhesive bonding, and the reinforcing fabric (30) covers the at least one electrical component (85) by way of its side which is averted from the subfloor (20), so that the top side of the at least one electrical component (85) is covered by the reinforcing fabric (30) and the curable material (45).