Floor lining and floor panel for a heated base

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Solution Overview

Problem

Floor coverings with wood-based materials and plastics have limited thermal conductivity, leading to inefficient heat transport from underfloor heating systems, which results in higher energy consumption and uneven temperature distribution, causing potential damage to the panels.

Innovation Solution

Incorporating mineral and/or metallic materials with higher thermal conductivity into a layer beneath the coating of the floor panels, either as a dispersed phase or a large-area element, to enhance heat conduction both perpendicular and parallel to the floor covering, thereby improving the evenness of the temperature profile and heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by stationary object

If wood-based materials or plastics are used as carrier plates in floor panels, then the structural integrity and durability of the floor covering are maintained, but the thermal conductivity is limited, resulting in higher energy consumption for underfloor heating

Engineering Contradiction:
Improveenergy consumptionVSAvoidthermal conductivity
Core Design Contradiction:
Use of energy by stationary objectVSReliability

Solution Approach 1:

The patent applies composite materials by combining wood-based carrier plates with mineral and/or metallic components (such as sand, granite, basalt, steel, or aluminum) to create a hybrid structure. This composite approach enables the floor panel to maintain the structural properties of wood while gaining the high thermal conductivity of mineral and metallic materials, thereby resolving the contradiction between durability and thermal efficiency.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention implements local quality by strategically placing thermally conductive mineral and/or metallic components specifically in the lower region of the carrier plate, close to the heating source. This localized enhancement of thermal conductivity where it is most needed (at the interface with the heating element) allows efficient heat transfer without compromising the overall structural integrity of the wood-based panel.

Inventive Principle:
Principle #3Local quality

2Use of energy by stationary object

If high temperatures are applied to improve heat transport, then thermal efficiency increases, but the panels may overdry and form gaps or cracks in the surface layers

Engineering Contradiction:
Improveheat transport efficiencyVSAvoidpanel damage from overheating
Core Design Contradiction:
Use of energy by stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent introduces mineral and/or metallic components as intermediary elements between the heating source and the wood-based carrier plate. These intermediaries facilitate more efficient and uniform heat distribution across the panel, preventing localized overheating that would cause drying and cracking, while still achieving the desired thermal efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the thermal parameters of the floor panel system by incorporating materials with different thermal conductivities. The mineral and metallic components create a more favorable temperature gradient distribution, allowing heat to be transported efficiently without creating excessive temperature differences that would lead to panel damage.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the coating layer with mineral components is made thicker to improve heat conduction, then thermal conductivity increases, but the protective function against abrasion is reduced

Engineering Contradiction:
Improveheat conductionVSAvoidabrasion resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies local quality by concentrating the thermally conductive mineral and/or metallic components in the lower region of the carrier plate, away from the top surface coating. This spatial differentiation allows the top coating to maintain its thin, abrasion-resistant structure while the lower regions provide enhanced thermal conductivity, resolving the contradiction between protective function and heat conduction.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly improves heat transport into the room, reduces energy consumption, and prevents damage from excessive temperatures by ensuring a more uniform temperature distribution, enhancing both thermal efficiency and durability of the floor covering.

Implementation Method 1

Mineral and/or metallic materials have a higher thermal conductivity λ compared to wood-based materials and/or plastics. If these materials are introduced into a layer of the floor covering, the overall thermal conductivity of the floor covering is improved.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The invention has recognized that the heat-conducting layer of the floor covering not only improves the heat conduction perpendicular to the floor covering, but also parallel to the floor covering. This achieves a more uniform temperature profile of the substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2246501B1Floor lining and floor panel for a heated base
Publication Date: 2017.01.25 FRITZ EGGER GMBH & CO OG
  • EP2246501B1 patent drawingFigure 1~2
  • EP2246501B1 patent drawingFigure 3~4
  • EP2246501B1 patent drawingFigure 5~6

AI summary

The lining (1) has multiple floor panels (2) connected with each other and formed from a wood material. Each floor panel includes a carrier plate (4) made of plastic and/or wood-plastic-mixture and a coating (7) arranged on the carrier plate. An upper layer (8) is formed by the coating of each floor panel. A thermoconductive layer (5) i.e. vapor barrier, is arranged below the upper layer, is formed by the carrier plate of each floor panel, and includes mineral- and/or metallic components (6) provided as fabric, non-woven, mesh or foil.