Floor Slab Chamfering via Preliminary Action

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Solution Overview

Problem

Existing methods for forming chamfers on floor slab units either result in high dimensional inaccuracies, reduce the strength of joints, or are unsuitable for ultra-thin boards, and they often affect the surface glossiness and visual texture of the flooring.

Innovation Solution

A floor slab unit with chamfers is developed, featuring a substrate layer and a finish paint layer, where the chamfered area has the same finish paint layer thickness and surface glossiness as the body area, and the chamfers can be either planar or arc-shaped.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If mold pressing is used to form chamfers, then the three-dimensional effect and overall texture are improved, but the cutting accuracy deteriorates and dimensional control becomes difficult

Engineering Contradiction:
Improvethree-dimensional effectVSAvoidcutting accuracy
Core Design Contradiction:
ShapeVSManufacturing precision

Solution Approach 1:

The chamfer is formed on the board before the finish paint layer is applied. This preliminary formation of the chamfered structure allows subsequent cutting operations to be performed with standard accuracy, as the chamfer geometry is already established. The finish paint layer is then applied to the pre-chamfered surface, ensuring that the final product achieves both the desired three-dimensional effect and acceptable manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

2Shape

If mold pressing is used to form chamfers, then the chamfered structure is created, but the strength at the joint between mortise lock buckles is reduced

Engineering Contradiction:
Improvechamfered structureVSAvoidjoint strength
Core Design Contradiction:
ShapeVSStrength

Solution Approach 1:

The chamfer is formed on the board before the finish paint layer is applied. This preliminary formation of the chamfered structure allows subsequent cutting operations to be performed with standard accuracy, as the chamfer geometry is already established. The finish paint layer is then applied to the pre-chamfered surface, ensuring that the final product achieves both the desired three-dimensional effect and acceptable manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

3Shape

If mold pressing is used to form chamfers on ultra-thin boards, then the chamfered structure is created, but the boards are damaged and rupture occurs

Engineering Contradiction:
Improvechamfered structureVSAvoidboard integrity
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The chamfer is formed on the board before the finish paint layer is applied. This preliminary formation of the chamfered structure allows subsequent cutting operations to be performed with standard accuracy, as the chamfer geometry is already established. The finish paint layer is then applied to the pre-chamfered surface, ensuring that the final product achieves both the desired three-dimensional effect and acceptable manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

4Ease of manufacture

If cutting is used to form chamfers, then the manufacturing process is simplified, but the surface glossiness of the chamfered area differs significantly from the body area

Engineering Contradiction:
Improveprocess simplicityVSAvoidsurface glossiness uniformity
Core Design Contradiction:
Ease of manufactureVSShape

Solution Approach 1:

The chamfer is formed on the board before the finish paint layer is applied. This preliminary formation of the chamfered structure allows subsequent cutting operations to be performed with standard accuracy, as the chamfer geometry is already established. The finish paint layer is then applied to the pre-chamfered surface, ensuring that the final product achieves both the desired three-dimensional effect and acceptable manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250198171A1Floor slab unit with chamfers, processing method, and processing device
Publication Date: 2025.06.19 LV JIAN
  • US20250198171A1 patent drawing
  • US20250198171A1 patent drawing

AI summary

The disclosure belongs to the field of board processing, and specifically relates to a floor slab unit with chamfers, a processing method, and a processing device. The floor slab unit includes at least a substrate layer and a finish paint layer disposed sequentially. The floor slab unit includes a body area and a chamfered areachamfered area formed on at least one edge, the finish paint layer thickness of the chamfered area is equal to that of the body area, and the difference between the surface glossiness of the chamfered area and the surface glossiness of the body area is no more than 1. Through the specific processing device and method, the disclosure solves the problem that the connection strength of floor slab units is reduced, while ensuring overall visual effect improvement. Moreover, surface performance is not affected, and better three-dimensional effects and overall texture are achieved.