Floor/Wallboard Buffer Layer with Holes for Adhesive Bonding
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Solution Overview
Problem
Thin floor/wallboards with poor sound insulation and adherence due to lack of lock catches, requiring alternative securing methods like adhesives, which often result in inadequate bonding.
Innovation Solution
Incorporating a buffer layer with holes on the back surface of the floor/wallboard, made from materials like foamed PVC, cork wood, or IXPE, to increase the contact area with adhesive, combined with a self-adhesive and release layer for enhanced fixation and sound insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a buffer layer is added to the back surface of thin floor/wallboards to improve sound insulation and adherence, then the bonding strength and sound insulation performance are improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The buffer layer is designed with a porous structure containing multiple holes that extend from the back surface to the main body layer. This porous structure increases the contact area between adhesive and the buffer layer, enabling stronger bonding while maintaining the thin profile of the floor/wallboard. The holes allow adhesive to penetrate and form bonds with both the main body layer and backing surface simultaneously.
Solution Approach 2:
The buffer layer is constructed from composite materials such as foamed PVC, cork wood, foamed EVA, or IXPE (crosslinked polyethylene foaming material). These composite materials provide both sound insulation properties and adequate mechanical strength for adherence, resolving the contradiction between improving reliability and managing structural complexity.
2Reliability
If holes are created in the buffer layer to increase adhesive contact area, then the bonding strength is improved, but the manufacturing precision and production difficulty increase
Solution Approach 1:
The holes in the buffer layer are designed to extend through the entire thickness of the buffer layer from the back surface to the main body layer, creating a through-hole structure. This design ensures that adhesive can fully penetrate the buffer layer and form bonds with both the main body layer and backing surface, maximizing bonding strength while providing a clear manufacturing target for hole depth.
Solution Approach 2:
The buffer layer is segmented with multiple holes distributed across its surface, with each hole serving as an independent adhesive penetration channel. The holes can be arranged in various patterns, logos, or characters, providing manufacturing flexibility while ensuring adequate adhesive contact area throughout the buffer layer.
3Quantity of substance
If thin floor/wallboards are used to reduce cost, then the material cost is reduced, but the sound insulation performance and adherence are deteriorated
Solution Approach 1:
The buffer layer with its porous structure containing multiple holes provides sound insulation functionality while enabling strong adhesive bonding. The porous structure absorbs and dampens sound waves, and the holes allow adhesive penetration to create strong bonds, thereby improving reliability without requiring thicker materials.
Solution Approach 2:
The buffer layer is constructed from composite materials such as foamed PVC, cork wood, foamed EVA, or IXPE that provide both sound insulation properties and mechanical strength. These composite materials deliver adequate sound insulation performance in a thin profile, maintaining cost-effectiveness while improving the deficiencies of thin floor/wallboards.
Data Source
AI summary
An adhesive floor/wallboard includes a floor/wallboard main body layer and a buffer layer adhered to the back surface of the floor/wallboard main body layer. The buffer layer is provided with a plurality of holes. The holes extend through the buffer layer to the main body layer. Glue is deposited in the holes. The buffer layer is adhered to the back surface of the floor/wallboard. The glue in the holes makes direct contact with the floor/wallboard main body at the holes. Due to the holes and their depth, the contact area between the glue, the buffer layer and the main body is increased. Accordingly, the adhesive floor/wallboard can be more firmly adhered to a backing surface.