Flooring Electric Component Adhesion Recesses
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Solution Overview
Problem
Existing flooring technologies with embedded electric components face challenges in ensuring optimal adhesion and connection between the components and the subfloor, leading to potential detachment and reduced performance in sensor-based detection applications.
Innovation Solution
Incorporating adhesion promoters and recesses on the electric components, particularly on their surfaces and edges, to enhance the bonding between the hardenable material and the subfloor, thereby creating a stable connection and improving capacitance for sensor detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electric component is embedded in the hardenable material without additional adhesion features, then the manufacturing process is simple, but the adhesion between the component and subfloor is insufficient
Solution Approach 1:
The patent applies preliminary action by incorporating adhesion promoters and recesses into the electric component during manufacturing, before the component is installed in the flooring. The adhesion promoter is pre-applied to the lower side of the component, and recesses are pre-formed in the component structure, ensuring that when the component is embedded in the hardenable material, these adhesion features are already in place to create strong bonding with the subfloor without requiring additional manufacturing steps later.
Solution Approach 2:
The patent applies local quality by concentrating adhesion-enhancing features at specific locations on the electric component. The adhesion promoter is applied specifically to the lower side of the component that contacts the subfloor, and recesses are strategically positioned to maximize mechanical interlocking with the hardenable material. This localized approach to adhesion enhancement improves bonding reliability without unnecessarily complicating the entire component structure.
2Strength
If the electric component has a smooth surface without adhesion promoter, then the manufacturing process is simpler, but the bonding strength with hardenable material is reduced
Solution Approach 1:
The patent applies parameter changes by modifying the surface properties of the electric component through the application of adhesion promoter. The adhesion promoter changes the chemical and physical parameters of the component surface, creating a surface that chemically bonds with the hardenable material. This parameter change at the surface level significantly improves bonding strength without requiring fundamental changes to the manufacturing process of the bulk component structure.
Solution Approach 2:
The adhesion promoter acts as an intermediary substance between the electric component and the hardenable material. It forms a chemical bridge that bonds to both the component surface and the hardening material, creating a strong interface. This intermediary layer resolves the contradiction by enabling strong bonding without requiring complex manufacturing processes, as the adhesion promoter can be applied through standard coating techniques.
3Reliability
If recesses are added to the electric component for better fixation, then the connection between subfloor and hardenable material is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the electric component into distinct functional zones. The recesses create segmented regions in the component structure, allowing the hardenable material to flow into and around these segmented areas. This segmentation provides multiple anchoring points for the hardening material, improving fixation stability. The segmented design is integrated into the component manufacturing process, so while the geometry is more complex, the manufacturing steps remain manageable through standard molding or machining techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures better fixation and performance of electric components within the flooring, enhancing sensor detection capabilities by maintaining a strong connection and improving capacitance readings, which is crucial for applications like object or person detection.
Implementation Method 1
the at least one electric component comprises an adhesion promoter for the hardenable material
Implementation Method 2
Through the at least one recess or the arrangement of multiple recesses, the hardenable material can flow and thus establish a connection bridge
Implementation Method 3
The electrical capacitance which has an influence on the sensor-based detection of elements which lie on the flooring is advantageously particularly high in the electric components equipped according to the invention
Data Source
AI summary
A flooring as a covering for a subfloor, wherein the flooring includes a layer made from a hardenable material which is hardened when the flooring is in the finished state and in which at least one electric component is embedded, wherein the electric component includes a lower side facing the subfloor when in the mounted position, and an upper side opposite the lower side. It is provided that the at least one electric component includes at least one surface section, in particular the upper side and/or the lower side, an adhesion promoter for the hardenable material and/or at least one recess which extends from its upper side to its lower side.