Rear-Side Groove Formation in Flooring Panels for Weight Reduction
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Solution Overview
Problem
Thermoplastic flooring panels, such as LVT and SPC, are heavy, impacting their performance and increasing production and transportation costs, necessitating a need for weight reduction methods that also improve material efficiency and handling.
Innovation Solution
A method for forming weight-reducing grooves in board elements by removing material from the rear side using a processing tool, with controlled groove formation and alignment, utilizing a rotating cutting device and support member to create longitudinal and transverse grooves that enhance balancing and strength properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermoplastic flooring panels are made with solid material structure, then strength and stability are improved, but weight increases and material efficiency decreases
Solution Approach 1:
The panel is segmented by forming grooves that divide the solid material structure into separated regions. These grooves create a segmented architecture that maintains structural integrity while reducing overall material volume and weight, directly resolving the contradiction between strength and weight.
Solution Approach 2:
The grooves create a porous or hollow structure within the panel body, transforming the solid material into a porous configuration. This reduces material consumption and weight while maintaining sufficient strength through the engineered void structure, addressing both strength and weight requirements.
2Strength
If more material is used in panel manufacturing, then strength and stability are improved, but production cost and transportation cost increase
Solution Approach 1:
Material is extracted from the panel structure by removing portions to form grooves. This extraction reduces the total quantity of material required while maintaining structural strength through the strategically designed groove configuration, directly addressing the contradiction between material quantity and strength.
Solution Approach 2:
The panel structure is segmented into regions separated by grooves, allowing material to be removed from non-critical areas while preserving strength in load-bearing regions. This segmentation enables reduced material quantity without compromising overall panel strength.
3Weight of moving object
If grooves are formed by traditional cutting methods, then weight reduction is achieved, but manufacturing complexity and power consumption increase
Solution Approach 1:
A rotating processing tool with periodically arranged cutting edges is used to form grooves. The periodic arrangement of cutting edges on the rotating tool allows continuous groove formation through repeated cutting actions, simplifying the manufacturing process while achieving weight reduction through systematic material removal.
Solution Approach 2:
The rotating processing tool enables continuous groove formation as it moves through the panel material. The continuous rotation and cutting action maintains constant material removal without interruption, reducing manufacturing complexity compared to stop-start cutting methods while efficiently achieving weight reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces panel weight, improves material efficiency, and enhances panel strength and handling, while allowing for controlled groove formation and reduced power consumption.
Implementation Method 1
forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by a processing tool
Data Source
Figure 2a~2g
Figure 3a~3h
Figure 4a~4e
AI summary
There is disclosed a method for forming grooves (10) in a board element (200). The method comprises arranging the board element in contact with a support member (120), and forming at least one groove (10) in a rear side (220) of the board element by removing material, such as chips, from the board element by a rotating cutting device (131) comprising a plurality of tooth elements configured to rotate around a rotational axis. The method further comprises counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, comprises arranging at least a portion of the board element between an obstruction element (170) and the support member. The disclosure generally relates to methods and systems for forming groove(s) in a board element as well as to various panels comprising at least one groove.