Flow Control Valve Thermal Shielding for High-Temperature Gas
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Solution Overview
Problem
Conventional flow control valves for high-temperature fluids in semiconductor manufacturing face challenges such as increased size, reduced flow rate capacity, and higher power consumption due to reliance on heat radiation and long spacers, which also lead to thermal expansion issues and increased manufacturing costs.
Innovation Solution
A flow control valve design featuring a first thermal shield comprising a ceramic ring-like member and diaphragm spacer with low thermal conductivity, combined with a second thermal shield that includes a stress transferring means and a space for air or rare gas to effectively intercept heat from the fluid source, maintaining the laminated piezoelectric actuator within its heat-resistant temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a long spacer is used to radiate heat from the fluid passage to the outer air, then the temperature of the laminated piezoelectric actuator is reduced, but the device size increases and manufacturing cost increases
Solution Approach 1:
The patent places the first thermal shield (diaphragm spacer) inside the second thermal shield (ring-like member), creating a nested structure where the diaphragm spacer is positioned within the circular region defined by the ring-like member. This nested arrangement allows both thermal shields to work together in a compact configuration, reducing the overall spacer length while maintaining effective heat radiation from the fluid passage to the outer air.
Solution Approach 2:
The patent employs two different thermal shield materials with distinct properties: the diaphragm spacer is made of a material with lower thermal conductivity to prevent heat conduction to the actuator, while the ring-like member uses a material optimized for heat radiation. This composite approach allows each component to perform its specific thermal function efficiently, achieving actuator temperature control without requiring excessive spacer length.
2Length of stationary object
If the number of laminated layers in the actuator is reduced to shorten its length, then the device height is maintained, but the maximum displacement and flow rate capacity decrease
Solution Approach 1:
The patent introduces thermal shields (diaphragm spacer and ring-like member) as intermediary components between the fluid passage and the laminated piezoelectric actuator. These thermal shields serve as mediators that block and radiate heat before it reaches the actuator, allowing the actuator to be positioned closer to the fluid passage without excessive heat exposure. This enables maintaining a compact actuator length with sufficient laminated layers to preserve maximum displacement and flow rate capacity.
3Temperature
If heat radiation is used to cool the actuator, then the actuator temperature is controlled, but power consumption increases
Solution Approach 1:
The patent converts the harmful heat that would otherwise directly reach and overheat the actuator into a beneficial cooling mechanism. The diaphragm spacer and ring-like member are designed to radiate heat toward the outer air, transforming the heat energy into a controlled thermal radiation process that actively cools the actuator. This passive heat radiation approach reduces reliance on active cooling systems, thereby lowering overall power consumption while maintaining actuator temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design efficiently prevents heat transmission to the laminated piezoelectric actuator, maintaining its temperature below the heat-resistant limit, allowing for compact and cost-effective operation while maintaining flow rate capacity and reducing thermal expansion concerns.
Implementation Method 1
heat transmitted from the fluid to the laminated piezoelectric actuator is intercepted before being transmitted to the actuator
Implementation Method 2
heat transmitted from the fluid is radiated to open air from a cooling fin disposed on the outer periphery of the spacer
Data Source
AI summary
A first thermal shield constituted by a material with a thermal conductivity of 20 W/(m·K) or less and a second thermal shield constituted by a space are disposed between a passage and a laminated piezoelectric actuator. Preferably, a third thermal shield with a thermal conductivity of 20 W/(m·K) or less is further disposed. Thereby, a flow control valve which can effectively intercept a transmission of heat using a simpler and compacter structure than a flow control valve according to a conventional technology so that the temperature of a laminated piezoelectric actuator does not exceed its heat-resistant temperature even when it is used for high-temperature process gas is provided.


