Flow-Cooled Power Electronics Using Ambient Air Convection
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Solution Overview
Problem
Existing power electronic systems for controlling electric machines in supercharger systems face challenges in heat management, leading to performance degradation and increased costs due to complex cooling systems like water cooling circuits and fans, especially in thermally restrictive environments near internal combustion engines.
Innovation Solution
A cooling device with a hose for circulating ambient temperature air, featuring a first heat exchange surface thermally connected to power electronic components and a second heat exchange surface inside the hose for convection heat removal, along with a heat sink that surrounds the hose and fins for enhanced heat transfer, allowing efficient heat dissipation without the need for complex cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water cooling circuits or fans are used to cool power electronic components, then the heat dissipation effectiveness is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The invention extracts the cooling function from complex water cooling circuits and fans, implementing it through a simplified air cooling system using the existing air intake hose and a dedicated cooling fin structure. This removes unnecessary complexity while maintaining heat dissipation effectiveness.
Solution Approach 2:
The cooling system utilizes the vehicle's existing air intake flow to cool the power electronic components, making the system self-servicing without requiring additional active cooling components like fans or water pumps. The air flow that would otherwise be wasted is now used for cooling purposes.
2Ease of manufacture
If power electronic components are positioned close to the electric machine, then wiring costs and space requirements are reduced, but heat management becomes more difficult
Solution Approach 1:
The invention merges the power electronic components with the electric machine housing, integrating the inverter directly into the motor structure. This consolidation reduces wiring requirements and space while the integrated cooling fins provide immediate heat dissipation capability, solving the heat management issue that would otherwise arise from close positioning.
Solution Approach 2:
The invention adds a thermal management dimension to the mechanical housing by incorporating cooling fins and air flow channels, transforming the housing from a simple structural element into an active heat dissipation system. This allows close positioning of components without compromising thermal management.
3Reliability
If expensive heat-resistant power components are used to withstand high temperatures near the engine, then the reliability in thermal environments is improved, but the manufacturing cost increases
Solution Approach 1:
The invention implements preliminary cooling action by positioning the power electronic components in a dedicated cooling zone with direct air flow access and cooling fins, preventing temperature rise before it becomes problematic. This allows the use of standard, cost-effective components rather than expensive heat-resistant variants.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the service life of power electronic systems, enables the use of inexpensive components, reduces design and material costs, and allows for compact, efficient cooling, positioning the system close to the electric machine while minimizing wiring and space requirements.
Implementation Method 1
a first heat exchange surface (6) which is thermally connected to the power electronic components (2)
Implementation Method 2
at least one second heat exchange surface (7) for heat exchange with the circulating flow (5), which second heat exchange surface (7) is fitted inside the circulation hose (4) to remove heat by convection with the circulating flow (5)
Implementation Method 3
The cooling device (1) comprises a heat sink (8) which connects the first heat exchange surface (6) with the second heat exchange surface (7), and the heat sink (8) at least partly surrounds the flow circulation hose (4)
Data Source
AI summary
The invention is a device (1) for cooling a power electronic system (EP) comprising at least one power electronic component (2) mounted on at least one circuit board (3), the cooling device (1) comprises a hose (4) for circulating a flow (5) at an ambient temperature. The cooling device (1) comprises a first heat exchange surface (6) that is thermally connected to the power electronic components (2) and at least one second heat exchange surface (7). The second heat exchange surface (7) is for heat exchange with the flow (5) circulating through the hose. The second heat exchange surface (7) is fitted inside the circulation hose (4) to remove heat by convection with the circulating flow (5). The second heat exchange surface (7) is thermally connected to the first heat exchange surface (6).