Immersed Liquid Cooling With Flow-Equalizing Plates
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Solution Overview
Problem
Existing blockchain servers face challenges in achieving consistent heat dissipation due to inconsistent flow distribution in immersion-type single-phase liquid cooling, leading to large temperature differences and high temperatures in certain areas, which affects overall system performance.
Innovation Solution
An immersed liquid cooling system with flow-equalizing plates and a cooling circulation device that includes flow-equalizing holes of varying sizes and configurations to ensure consistent fluid flow across computing devices, combined with a temperature control mechanism using a PID thermostat and multiple cooling assemblies to maintain stable temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If immersion-type single-phase liquid cooling is used, then heat dissipation efficiency is improved, but flow distribution consistency deteriorates
Solution Approach 1:
The patent applies local quality by creating different flow resistance characteristics in different regions of the cooling system. Flow equalizing plates with specifically designed hole distributions are placed at different locations to locally adjust fluid flow, ensuring that high-flow regions receive less flow while low-flow regions receive more flow, thereby achieving overall flow distribution consistency while maintaining high heat dissipation efficiency
Solution Approach 2:
The patent changes physical parameters of the cooling system by introducing flow equalizing plates with varying hole sizes, shapes, and distributions. These structural modifications alter the flow resistance parameters locally, transforming the uniform high-flow state into a balanced flow distribution state that maintains high heat dissipation efficiency while improving flow consistency
2Use of energy by moving object
If flow rate is reduced in certain areas, then energy consumption is reduced, but temperature control deteriorates
Solution Approach 1:
The patent implements feedback control by using temperature sensors to monitor the thermal state of computing devices and adjusting the flow distribution accordingly. The flow equalizing plates are designed to respond to temperature variations by redirecting coolant flow to high-temperature regions, ensuring effective temperature control while optimizing energy consumption through adaptive flow management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves consistent temperature distribution and improved heat dissipation efficiency, enhancing computing power and energy efficiency while reducing power consumption and ensuring temperature stability across all computing devices.
Implementation Method 1
The cooling liquid is circulated through the cooling circulation device, that is, the cold cooling liquid is continuously input and the hot cooling liquid is drawn out, to dissipate heat for the plurality of computing devices
Implementation Method 2
the cooling liquid is circulated through the cooling circulation device
Implementation Method 3
A plurality of flow-equalizing holes 190S are formed on the flow-equalizing plate 190. The flow-equalizing holes 190S are used to equalize the fluid flow for the computing devices 300 to be cooled in different parts
Data Source
AI summary
Disclosed is an immersed liquid cooling heat dissipation system, which comprises a liquid cooling module, an oil path circulation device, and a plurality of computing devices to undergo heat dissipation. Each computing device comprises a frame, a control module, a power module, and computing modules. The liquid cooling module comprise a first device slot tank, a second device slot tank, a return flow slot tank, and a flow-equalizing plate. The return flow slot tank is located between the first device slot tank and the second device slot tank, wherein the flow-equalizing plate is disposed in the first device slot tank and the second device slot tank, and the computing devices are disposed on the flow-equalizing plate. The frame is internally provided with a power module accommodating region used for accommodating the power module and a computing module accommodating region used for accommodating the computing module.