Flow Equalizing Plate Layout for Uniform Epitaxial Gas Distribution
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Solution Overview
Problem
The uneven diffusion of process gas above a reactant in an epitaxial process chamber leads to poor thickness uniformity of films in semiconductor manufacturing, affecting reaction results.
Innovation Solution
A reaction device with a flow equalizing plate and intake assembly, where the flow equalizing plate has a protruding wall surface facing the cover plate and a recessed surface facing the intake assembly, along with strategically positioned intake ports and exhaust assembly, ensures uniform gas distribution and consistent gas flow resistance, enhancing film thickness uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional epitaxial process chamber is used with simple gas introduction, then the device structure remains simple, but the process gas diffusion above the reactant becomes uneven, resulting in poor film thickness uniformity
Solution Approach 1:
The reaction device is segmented into multiple functional components: a reaction chamber, a cover plate with multiple intake ports, and a flow equalizing plate with multiple outlets. This segmentation allows independent optimization of gas introduction and distribution functions, enabling uniform gas flow across the reactant surface while maintaining a manageable structural complexity through modular design
Solution Approach 2:
The flow equalizing plate serves as an intermediary component between the cover plate and the reactant. It receives process gas from the cover plate through multiple outlets and distributes it uniformly across the reactant surface. This intermediary structure mediates the gas flow transformation from concentrated intake ports to distributed uniform coverage, achieving improved film thickness uniformity without requiring direct complex configuration at the reactant interface
2Manufacturing precision
If the process gas is introduced through a single intake port, then the device structure remains simple, but the gas distribution uniformity across the reactant surface deteriorates
Solution Approach 1:
The intake assembly is segmented into multiple intake ports distributed across the cover plate, with each port connected to the flow equalizing plate. This segmentation enables multiple gas introduction points that feed into the flow equalizing plate, creating a distributed gas supply network that improves gas distribution uniformity while keeping each individual intake connection relatively simple
Solution Approach 2:
Different regions of the cover plate are equipped with intake ports at strategically positioned locations to match the reactant geometry. The flow equalizing plate features outlets with locally optimized configurations, including arc-shaped surfaces with specific central angles, to ensure uniform gas distribution across different areas of the reactant surface
3Productivity
If the distance between the cover plate and reactant is reduced, then the gas diffusion path is shortened improving reaction efficiency, but the gas flow resistance becomes inconsistent across the reactant surface
Solution Approach 1:
The flow equalizing plate is designed with a specific geometry where the distance from each outlet to the reactant surface is optimized to create equipotential gas flow conditions. By carefully designing the outlet positions and the arc-shaped surfaces, the system achieves consistent gas flow resistance across all outlets, ensuring uniform gas distribution even when the overall distance to the reactant is reduced for improved reaction efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The uniform gas distribution and consistent gas flow resistance improve the thickness uniformity of films on reactants, ensuring more uniform contact and reaction outcomes.
Implementation Method 1
diffusion of the process gas above a reactant is usually not uniform enough
Data Source
AI summary
A reaction device includes a reaction housing defining a reaction chamber that is configured to accommodate a reactant, a first cover plate, an intake assembly that is disposed on the first cover plate and communicated with the reaction chamber, and a flow equalizing plate disposed between the first cover plate and the reaction housing. The reaction housing includes a first end and a second end opposite to each other. The first cover plate is disposed on the first end. An arrangement direction of the first cover plate and the flow equalizing plate is perpendicular to a vertical axis of the reactant, a wall surface of the flow equalizing plate facing the first cover plate is configured as a protrusion, and a wall surface of the first cover plate facing the flow equalizing plate is configured as a recess. A semiconductor coating device and a coating method are further provided.