Flow Path Member With Coarse Wall For Turbulent Heat Exchange
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Solution Overview
Problem
Current flow path members for semiconductor manufacturing lack efficient heat exchange capabilities, necessitating an improvement in heat exchange efficiency for effective wafer heating and cooling processes.
Innovation Solution
A flow path member design featuring a third wall with a coarse portion that is coarser than the rest, combined with a metal member on the first or second wall, promotes turbulent fluid flow and enhances heat exchange efficiency, while a semiconductor manufacturing apparatus incorporates this design for precise wafer handling and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional flow path member with smooth walls is used, then the device structure is simple, but the heat exchange efficiency is insufficient
Solution Approach 1:
The invention applies local quality by providing a coarse portion only in specific areas of the flow path (on the third wall) rather than making the entire flow path complex. This localized roughness treatment creates turbulent flow and enhances heat exchange efficiency at critical locations while keeping the overall device structure relatively simple.
Solution Approach 2:
The coarse portion in the flow path can be considered as creating a porous-like surface structure that disrupts laminar flow and promotes turbulent flow. This surface texture modification enhances heat transfer without requiring a complete redesign of the flow path geometry.
2Temperature
If the fluid flow velocity is increased to improve heat exchange, then the heat transfer rate increases, but the pressure loss increases
Solution Approach 1:
The coarse portion in the flow path creates flow disturbances and turbulence that act similarly to mechanical vibration, enhancing heat transfer through increased fluid mixing and contact with the wall surface. This turbulence-induced heat transfer enhancement is more efficient than simply increasing flow velocity, thereby reducing the associated pressure loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly increases heat exchange efficiency, allowing for accurate and efficient semiconductor component manufacturing by ensuring high heat transfer rates and durability, reducing thermal stress and maintaining consistent temperatures.
Implementation Method 1
a coarse portion that is coarser than the other portions is provided in a part of a surface of the third wall on the flow path side, and thus, a turbulent flow easily occurs in the fluid
Implementation Method 2
a metal member is provided on the surface or inside of at least one of the first wall and the second wall of the flow path member
Implementation Method 3
the metal member is an electrode for attracting a wafer
Data Source
Figure 1(a)~1(b)
Figure 2(a)~2(b)
Figure 3(a)~3(c)
AI summary
[Object] To provide a flow path member having improved heat exchange efficiency, and a heat exchanger and a semiconductor manufacturing apparatus using this flow path member. [Solution] A flow path member includes a lid portion, a bottom plate portion, and side walls provided between the lid portion and the bottom plate portion, a flow path in which a fluid flows is configured with the lid portion, the side walls, and the bottom plate portion, a portion of a surface of the side walls on the flow path side includes a coarse portion that is coarser than the other portions, and accordingly, it is possible to suppress an obstruction of the flow of the fluid, the fluid easily turbulently flows due to the existence of the coarse portion, and it is possible to increase the heat exchange efficiency of the flow path member.