Flow Path Member Asymmetric Opening Design

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Solution Overview

Problem

In semiconductor devices, high fluid pressure for improved heat exchange efficiency leads to stress concentration and potential damage at the corners of adjacent refrigerant passages, reducing reliability.

Innovation Solution

A flow path member design with displaced flow path openings on a cut plane, where adjacent openings are positioned to increase the distance between their corners, reducing stress concentration and enhancing durability, using materials like silicon carbide for improved thermal conductivity and corrosion resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high fluid pressure is applied to improve heat exchange efficiency, then heat exchange efficiency is improved, but stress concentration occurs at the corners of adjacent refrigerant passages causing potential damage

Engineering Contradiction:
Improveheat exchange efficiencyVSAvoidreliability of refrigerant passages
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies asymmetry by intentionally designing the flow path openings to be non-uniformly distributed. Specifically, the distance between corners of adjacent flow path openings is made non-uniform, creating larger spacing in critical stress zones. This asymmetric arrangement redirects stress away from corner regions, preventing stress concentration while maintaining high fluid pressure for efficient heat exchange.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent implements local quality by varying the spacing between flow path openings at different locations. Rather than uniform distribution, the design creates locally optimized spacing where corner regions have larger distances between openings to reduce stress concentration, while other regions maintain tighter spacing for heat exchange efficiency. This localized variation in geometric quality addresses the specific stress problem at corners without compromising overall performance.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If uniform distribution of flow path openings is used, then manufacturing is simplified, but stress concentrates at corners of adjacent openings reducing reliability

Engineering Contradiction:
Improveease of manufacturing flow pathsVSAvoidreliability against stress damage
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent deliberately introduces asymmetry in the flow path opening distribution to prevent the stress concentration problem inherent in uniform designs. The non-uniform spacing, particularly the increased distance between corner regions of adjacent openings, creates a more reliable structure that withstands high fluid pressures without compromising manufacturability through standard ceramic forming and joining processes.

Inventive Principle:
Principle #4Asymmetry

3Reliability

If distance between corners of adjacent flow path openings is increased, then stress concentration is reduced improving reliability, but heat exchange efficiency may be compromised

Engineering Contradiction:
Improvereliability of flow pathVSAvoidheat exchange efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies local quality by selectively increasing the distance between flow path openings only in regions where stress concentration occurs (corner regions), while maintaining optimal spacing in other areas for heat exchange efficiency. This localized geometric variation ensures structural reliability without unnecessarily compromising the heat transfer performance of the overall heat exchanger.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively reduces stress concentration between flow path openings, suppressing damage and improving the reliability of the flow path member, heat exchanger, and semiconductor manufacturing device, while maintaining high heat exchange efficiency.

Implementation Method 1

a flow path member that includes a flow path through which a fluid flows and that performs heat exchange with another member in contact with the flow path member

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2879162B1Flow path member, and heat exchanger and semiconductor manufacturing device using same
Publication Date: 2020.07.29 KYOCERA CORP
  • EP2879162B1 patent drawingFigure 1
  • EP2879162B1 patent drawingFigure 2
  • EP2879162B1 patent drawingFigure 3

AI summary

[Object] To provide a flow path member, and a heat exchanger and a semiconductor manufacturing device using the flow path member, which are highly reliable. [Solution] There is provided a flow path member including: a first wall section 1; a second wall section 2; and a third wall section 3 that is provided between the first wall section 1 and the second wall section 2. An internal section that is configured by the first wall section 1, the second wall section 2, and the third wall section 3 becomes a flow path through which a fluid flows and a plurality of flow path openings 4 of the flow path are arranged in one direction on a cut plane obtained by cutting from the first wall section 1 to the second wall section 2. Since one of two adjacent flow path openings 4 is disposed to be more displaced than the other either toward the first wall section 1 side or toward the second wall section 2 side, it is possible to reduce stress concentration between corners of adjacent flow path openings, it is difficult to damage the flow path, and it is possible to achieve a flow path member 10 of which reliability is improved.