Flow Path Member with Coarse Surface for Turbulent Heat Exchange
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Solution Overview
Problem
Current flow path members for semiconductor manufacturing lack efficient heat exchange capabilities, necessitating an improvement in heat exchange efficiency to effectively heat or cool wafers during manufacturing processes.
Innovation Solution
A flow path member design featuring a third wall with a coarse portion that is coarser than the rest, promoting turbulent flow, combined with a metal member on at least one of the first and second walls, enhances heat exchange efficiency and includes a semiconductor manufacturing apparatus using this configuration for precise wafer handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional smooth flow path is used, then the fluid flow is stable and easy to control, but the heat exchange efficiency is insufficient
Solution Approach 1:
The flow path member applies local quality by providing a coarse portion only at specific locations (inlet region or opposite to outlet) rather than making the entire surface rough. This localized roughness treatment induces turbulence where needed for enhanced heat exchange while maintaining smoother regions elsewhere to control overall flow stability.
Solution Approach 2:
The invention changes the surface roughness parameter of the flow path member by introducing a coarse portion with controlled roughness characteristics. This parameter change transforms the fluid flow regime from laminar to turbulent in specific regions, thereby improving heat exchange efficiency without requiring complete redesign of the flow path geometry.
2Temperature
If a coarse portion is added to the flow path surface, then turbulent flow and heat exchange efficiency are improved, but manufacturing complexity increases
Solution Approach 1:
By limiting the coarse portion to specific regions rather than treating the entire surface, the manufacturing process becomes more manageable. Localized roughness treatment allows for targeted application methods such as localized blasting, coating, or forming techniques, reducing overall manufacturing complexity compared to treating the entire surface.
Solution Approach 2:
The invention applies partial action by providing roughness only in necessary regions (inlet or opposite to outlet) rather than uniformly across the entire flow path surface. This partial treatment achieves the required turbulence induction for heat exchange while minimizing the total area requiring complex manufacturing processes.
3Temperature
If metal members are added to enhance heat exchange, then heat exchange efficiency and durability are improved, but device complexity and cost increase
Solution Approach 1:
The invention merges the heat exchange function with the flow path structure itself by incorporating metal members directly into the flow path member. This integration eliminates the need for separate heat exchange components, reducing overall device complexity while achieving enhanced heat exchange efficiency through the metal's superior thermal conductivity.
Solution Approach 2:
The flow path member employs composite material construction by combining metal members with other materials (such as ceramics or polymers) to create a hybrid structure. This composite approach leverages the high thermal conductivity of metal regions for heat exchange while utilizing the properties of other materials for structural support, corrosion resistance, or electrical insulation, thereby improving overall performance without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly increases heat exchange efficiency by inducing turbulent flow and provides a semiconductor manufacturing apparatus capable of high-accuracy component manufacturing with improved durability and corrosion resistance.
Implementation Method 1
a coarse portion that is coarser than the other portions is provided in a part of a surface of the third wall on the flow path side, and thus, a turbulent flow easily occurs in the fluid
Implementation Method 2
a metal member is provided on the surface or inside of at least one of the first wall and the second wall of the flow path member
Implementation Method 3
the metal member is an electrode for attracting a wafer
Data Source
AI summary
A flow path member includes a lid portion, a bottom plate portion, and side walls provided between the lid portion and the bottom plate portion, a flow path in which a fluid flows is configured with the lid portion, the side walls, and the bottom plate portion, a portion of a surface of the side walls on the flow path side includes a coarse portion that is coarser than the other portions.