Temperature adjustment device and method for manufacturing temperature adjustment device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Contamination of liquids used in semiconductor manufacturing can lead to defects in the manufacturing process, particularly due to surface roughness issues in temperature adjustment devices.
Innovation Solution
A temperature adjustment device is designed with a flow path plate having a surface roughness of 0.20 μm to 0.25 μm, manufactured using injection-molding to minimize contamination by reducing foreign matter release and ensuring smooth surface contact, incorporating a thermoelectric module for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the surface roughness of the flow path plate is reduced to minimize contamination, then liquid contamination is suppressed, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a quantitative parameter range for surface roughness (0.20 μm or more and 0.25 μm or less) to optimize the balance between contamination suppression and manufacturing feasibility. This parameter change transforms a qualitative requirement into a measurable, controllable specification that resolves the contradiction between minimizing contamination and maintaining manufacturing precision.
2Manufacturing precision
If injection-molding is used to manufacture the flow path plate for smooth surfaces, then surface roughness is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical machining methods with injection-molding technology to achieve the required surface roughness. This substitution eliminates complex post-processing steps and tooling requirements, thereby reducing manufacturing complexity while maintaining or improving surface quality.
3Reliability
If the flow path plate surface is made smoother to prevent foreign matter release, then liquid purity is improved, but production cost increases
Solution Approach 1:
The patent incorporates surface roughness control as a built-in feature of the injection-molding process itself, rather than requiring separate post-processing steps. By performing the surface finishing action during the primary manufacturing process, the patent achieves high liquid purity standards while avoiding additional production costs associated with secondary operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively suppresses liquid contamination, preventing manufacturing defects in semiconductor devices by ensuring a smooth and clean surface for liquid flow, thereby enhancing the reliability of the semiconductor manufacturing process.
Implementation Method 1
a thermoelectric module plate that is connected to the heat transfer plate
Data Source
AI summary
A temperature adjustment device includes a flow path plate that includes a flow path groove, a heat transfer plate that faces the flow path groove, and a thermoelectric module plate that is connected to the heat transfer plate. A surface roughness of the flow path plate is 0.20 μm or more and 0.25 μm or less.