Flow Rate Sensor Thermal Isolation via Floating Mount
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Solution Overview
Problem
The thermal influence on thermo-sensitive resistors in existing flow rate sensor devices reduces sensor responsiveness, as the substrate with these resistors is not effectively isolated from thermal influences, leading to decreased performance.
Innovation Solution
A flow rate sensor device design where the sensor unit is mounted within a unit body and accommodated in a case, with the sensor unit supported away from the case's bottom surface, utilizing a narrow connection portion to separate heat sources and enhance heat dissipation, thereby reducing thermal influence on the sensor unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the substrate with thermo-sensitive resistors is accommodated in a case for protection and easy attachment, then the device structure is simplified and attachment is easier, but thermal influence to the sensor part increases and sensor responsiveness is reduced
Solution Approach 1:
The device is divided into distinct functional modules: a sensor unit containing the substrate with thermo-sensitive resistors, and a separate case for protection. The sensor unit can be attached to the case through various methods (adhesive, screws, clips), allowing independent optimization of each component. This segmentation enables the sensor unit to be designed for high responsiveness while the case provides protection and ease of attachment.
Solution Approach 2:
A thermal isolation structure is introduced as an intermediary between the sensor unit and the case bottom surface. This intermediary component (such as a heat-resistant resin layer or air gap) blocks thermal conduction from the case to the sensor, reducing thermal influence while maintaining the protective enclosure and easy attachment benefits.
2Volume of moving object
If the sensor unit is placed close to the bottom surface of the case for compact design, then the device size is reduced, but thermal influence from the bottom surface increases and sensor responsiveness deteriorates
Solution Approach 1:
The case bottom surface is designed with differentiated thermal properties: a heat-resistant resin layer or insulating material is applied locally at the contact area with the sensor unit, while other areas may have different properties. This local quality change provides thermal isolation exactly where needed (at the sensor interface) without compromising overall device compactness.
Solution Approach 2:
Instead of increasing horizontal separation distance between the sensor unit and case bottom, the design introduces vertical dimension solutions: an air gap created by support structures, or a multi-layer bottom surface with insulating layers. This dimensional approach maintains compact footprint while achieving thermal isolation through the vertical stack.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves sensor responsiveness by effectively separating heat sources and enhancing heat dissipation, maintaining good sensor performance and reducing thermal interference.
Implementation Method 1
the sensor unit is supported away from a bottom surface of the case... enhancing heat dissipation, thereby reducing thermal influence on the sensor unit
Implementation Method 2
enhancing heat dissipation, thereby reducing thermal influence on the sensor unit
Data Source
AI summary
It is an object to provide a flow rate sensor device having improved sensor responsiveness compared with the prior art. The present invention is a flow rate sensor device including a sensor element that detects a flow rate; a unit body including a sensor unit in which the sensor element is mounted, and a case accommodating the unit body, wherein the sensor unit is supported away from a bottom surface of the case. In this way, the sensor unit is supported to float upward from the bottom surface of the case, and a space is provided between the sensor unit and the bottom surface. Therefore, heat caused in the sensor unit can be separated from outside, and good sensor responsiveness can be maintained.