Flow Sensor Package Support Structure for Stable Passage Geometry
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Solution Overview
Problem
The flow rate measurement device in existing technologies is prone to variations in detection accuracy due to an unstable posture of the chip package relative to the board, which can cause changes in passage size and affect measurement precision.
Innovation Solution
The device incorporates a resin package with protrusions projecting from the leading end portion to stabilize the chip package's posture on the circuit board, preventing inclination and maintaining consistent passage size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the chip package is fixed to the board through soldering in a cantilever state, then the device structure is simple and easy to manufacture, but the posture of the chip package becomes unstable and inclination occurs
Solution Approach 1:
The support structure is segmented into multiple protrusions (first protrusion at the base end portion and second protrusion at the leading end portion) that are separately formed on the board. This segmentation allows each protrusion to independently support a specific portion of the chip package, distributing the support function and preventing rotational inclination while maintaining manufacturing simplicity.
2Device complexity
If the chip package is fixed by soldering with a posture further inclined relative to the board, then the device structure is simple, but the size of the passage changes and flow rate detection accuracy varies
Solution Approach 1:
The protrusions are preliminarily formed on the board at predetermined positions before the chip package is mounted. The first protrusion is positioned to support the base end portion and the second protrusion is positioned to support the leading end portion, establishing a predetermined support arrangement that pre-prevents inclination and ensures accurate passage dimensions for flow rate detection.
Data Source
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AI summary
The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.